Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

Metric Quad Flat Pack

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Amkor?셲 MQFP IC package portfolio provides

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Metric Plastic Quad Flatpack Packages

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Amkor’s MQFP (Metric Quad Flat Pack) packages allow the flexibility of growing or shrinking IC package size based upon application need.

FEATURES 10 x 10 mm to 32 x 32 mm body size 44-240 lead counts Custom leadframe design available Die up and down configurations High conductivity copper leadframes JEDEC standard compliant package outlines Integrated thermal enhancement available with heat spreader Fine pitch wireb

Heat Spreader Metric Quad Flat Pack

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Exposed Drop-in Heat Slug Metric Quad Flat Pack

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Exceptional thermal and electrical performance by design include the following

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