Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

Memory Card IC 256/128 Kbit Serial I짼C Bus EEPROM

DESCRIPTION Each device is an electrically erasable programmable memory (EEPROM) fabricated with STMicroelectronics’s High Endurance, Double Polysilicon, CMOS technology. This guarantees an endurance typically well above 100,000 Erase/Write cycles, with a data retention of 40 years. The memory op

包装：散装 描述：METRIC HEX STANDOFFPLAIN BRASS10 五金件，紧固件，配件 板垫片，支座

包装：散装 描述：METRIC HEX STANDOFFNO FINISH - N 五金件，紧固件，配件 板垫片，支座

26 (7/34) AWG Tinned Copper

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26 (7/34) AWG Tinned Copper

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26 (7/34) AWG Tinned Copper

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1/2 (12.7 mm) Single - Turn Wirewound Servo Mount Type Precision PotentiometerS

FEATURES • Ohmic value range: 50  up to 20 k • Smallest size available: 12.7 mm • Center tap on request • Custom shafts available on request • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Aluminum Electrolytic Capacitors Radial High Temperature Standard

FEATURES • Useful life: 2500 h at 105 °C • Miniaturized, high CV-product per unit volume • Charge and discharge proof • Polarized aluminum electrolytic capacitors, non-solid electrolyte • Radial leads, cylindrical aluminum case, insulated with a blue sleeve • Pressure relief for case Ø D ≥

Temperature Sensors Line Guide

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Aluminum Capacitors Radial High Temperature Standard

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Aluminum Electrolytic Capacitors

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