Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

Memory Card IC 256/128 Kbit Serial I짼C Bus EEPROM

DESCRIPTION Each device is an electrically erasable programmable memory (EEPROM) fabricated with STMicroelectronics’s High Endurance, Double Polysilicon, CMOS technology. This guarantees an endurance typically well above 100,000 Erase/Write cycles, with a data retention of 40 years. The memory op

Chem-Wik® Rosin

PRODUCT DESCRIPTION Chem-Wik Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik Rosin responds as much as 50% faster than conventional deso

Drive Fasteners

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Common Mode Inductors

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