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IS45S价格

参考价格:¥47.7338

型号:IS45S16160G-7CTLA1 品牌:ISSI 备注:这里有IS45S多少钱,2026年最近7天走势,今日出价,今日竞价,IS45S批发/采购报价,IS45S行情走势销售排行榜,IS45S报价。
型号 功能描述 生产厂家 企业 LOGO 操作

SDR SDRAM

·Synchronous, with 3.3V power supply\n·LVTTL interface\n·Programmable burst length (1, 2, 4, 8, full page)\n·Programmable burst sequence: Sequential/Interleave\n·Self refresh and Auto Refresh modes\n·Random column address every clock cycle\n·Programmable CAS latency (2, 3 clocks)\n·Burst read/write

ISSI

矽成半导体

SDR SDRAM

·Synchronous, with 3.3V power supply\n·LVTTL interface\n·Programmable burst length (1, 2, 4, 8, full page)\n·Programmable burst sequence: Sequential/Interleave\n·Self refresh and Auto Refresh modes\n·Random column address every clock cycle\n·Programmable CAS latency (2, 3 clocks)\n·Burst read/write

ISSI

矽成半导体

SDR SDRAM

·Synchronous, with 3.3V power supply\n·LVTTL interface\n·Programmable burst length (1, 2, 4, 8, full page)\n·Programmable burst sequence: Sequential/Interleave\n·Self refresh and Auto Refresh modes\n·Random column address every clock cycle\n·Programmable CAS latency (2, 3 clocks)\n·Burst read/write

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs

ISSI

矽成半导体

64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM

OVERVIEW ISSIs 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous;

ISSI

矽成半导体

64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM

OVERVIEW ISSIs 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous;

ISSI

矽成半导体

64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM

OVERVIEW ISSIs 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous;

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx32, 32Mx16, 64Mx8 512Mb SDRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM

FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply VDD & VDDQ: 3.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst

ISSI

矽成半导体

512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM

OVERVIEW ISSIs 64Mb Synchronous DRAM IS42/45S32200E is organized as 524,288 bits x 32-bit x 4-bank for improved performance. The synchronous DRAMs achieve high speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. GENERAL DES

ISSI

矽成半导体

512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM

OVERVIEW ISSIs 64Mb Synchronous DRAM IS42/45S32200E is organized as 524,288 bits x 32-bit x 4-bank for improved performance. The synchronous DRAMs achieve high speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. GENERAL DES

ISSI

矽成半导体

512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM

OVERVIEW ISSIs 64Mb Synchronous DRAM IS42/45S32200E is organized as 524,288 bits x 32-bit x 4-bank for improved performance. The synchronous DRAMs achieve high speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. GENERAL DES

ISSI

矽成半导体

IS45S产品属性

  • 类型

    描述

  • 型号

    IS45S

  • 制造商

    IDEC Corporation

  • 功能描述

    SENS.IND. 10-30VDC PNP NC

更新时间:2026-5-24 9:21:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ISSI
24+
TSOP56
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
ISSI
20+
TSOP
2960
诚信交易大量库存现货
ISSI
三年内
1983
只做原装正品
ISSI
23+24
TSOP
29650
原装正品优势渠道价格合理.可开13%增值税发票
ISSI
23+
TSSOP
57952
##公司主营品牌长期供应100%原装现货可含税提供技术
ISSI
25+
BGA90
3850
百分百原装正品 真实公司现货库存 本公司只做原装 可
ISSI
24+
TSOP86
9600
原装现货,优势供应,支持实单!
ISSI
原厂封装
9800
原装进口公司现货假一赔百
ISSI
2223+
TSOP86
26800
只做原装正品假一赔十为客户做到零风险
ISSI
2016+
TSSOP
4000
只做原装,假一罚十,公司可开17%增值税发票!

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