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IS45价格
参考价格:¥47.7338
型号:IS45S16160G-7CTLA1 品牌:ISSI 备注:这里有IS45多少钱,2026年最近7天走势,今日出价,今日竞价,IS45批发/采购报价,IS45行情走势销售排行榜,IS45报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
OPIC LIGHT DETECTOR WITH BULLT-IN SIGNAL PROCESSING CIRCULT FOR LIGHT MODULATION SYSTEM OPIC Light Detector with Built-In Signal Processing Circuit for Light Modulation System Applications 1. Optoelectronic switches 2. Copiers, printers, facsimiles | SHARPSharp Corporation 夏普 | |||
LINEAR OUTPUT TYPE OPIC LIGHT DETECTOR ■ Features 1. Liner output 2. Two package according to mounting method Side-view type (IS445) Top-view type (IS455) 3. Capable of output voltage level adjustment due to external resistor ■ Applications 1. Copiers | SHARPSharp Corporation 夏普 | |||
Linear Output Type OPIC Light Detector ■ Features 1. Liner output 2. Two package according to mounting method Side-view type (IS445) Top-view type (IS455) 3. Capable of output voltage level adjustment due to external resistor ■ Applications 1. Copiers | SHARPSharp Corporation 夏普 | |||
High Speed Response Type OPIC Light Detector ■ Features 1. High speed response (t PHL : TYP.230ns ) 2. Uses a pattern to allow for possible positional deviation of the semiconductor laser spot. 3. Compact, mini-flat package ■ Applications 1. Laser beam printers | SHARPSharp Corporation 夏普 | |||
High Speed Response Type OPIC Light Detector ■ Features 1. High speed response type (t PHL: TYP. 300ns) 2. Pattern with semiconductor laser spot positional deviation taken into consideration (Detector size : 0.5mm x 3.0mm ) 3. Open collector output 4. Angle adjustment by means of outer mounting resistance ■ Applications 1. Laser beam | SHARPSharp Corporation 夏普 | |||
4M x 16Bits x 4Banks Mobile Synchronous DRAM Features •JEDEC standard 3.3V, 2.5V, 1.8V power supply. •Auto refresh and self refresh. •All pins are compatible with LVCMOS interface. •8K refresh cycle / 64ms. •Programmable Burst Length and Burst Type. - 1, 2, 4, 8 or Full Page for Sequential Burst. - 4 or 8 for Interleave Burst. •Program | ISSI 矽成半导体 | |||
4M x 16Bits x 4Banks Mobile Synchronous DRAM Features •JEDEC standard 3.3V, 2.5V, 1.8V power supply. •Auto refresh and self refresh. •All pins are compatible with LVCMOS interface. •8K refresh cycle / 64ms. •Programmable Burst Length and Burst Type. - 1, 2, 4, 8 or Full Page for Sequential Burst. - 4 or 8 for Interleave Burst. •Program | ISSI 矽成半导体 | |||
4M x 16Bits x 4Banks Mobile Synchronous DRAM Features •JEDEC standard 3.3V, 2.5V, 1.8V power supply. •Auto refresh and self refresh. •All pins are compatible with LVCMOS interface. •8K refresh cycle / 64ms. •Programmable Burst Length and Burst Type. - 1, 2, 4, 8 or Full Page for Sequential Burst. - 4 or 8 for Interleave Burst. •Program | ISSI 矽成半导体 | |||
4M x 16Bits x 4Banks Mobile Synchronous DRAM Features •JEDEC standard 3.3V, 2.5V, 1.8V power supply. •Auto refresh and self refresh. •All pins are compatible with LVCMOS interface. •8K refresh cycle / 64ms. •Programmable Burst Length and Burst Type. - 1, 2, 4, 8 or Full Page for Sequential Burst. - 4 or 8 for Interleave Burst. •Program | ISSI 矽成半导体 | |||
1M x 16Bits x 2Banks Low Power Synchronous DRAM Features • JEDEC standard 3.3V, 2.5V, 1.8V power supply • Auto refresh and self refresh • All pins are compatible with LVCMOS interface • 4K refresh cycle / 64ms • Programmable Burst Length and Burst Type - 1, 2, 4, 8 or Full Page for Sequential Burst - 4 or 8 for Interleave Burst • Progra | ISSI 矽成半导体 | |||
1M x 16Bits x 2Banks Low Power Synchronous DRAM Features • JEDEC standard 3.3V, 2.5V, 1.8V power supply • Auto refresh and self refresh • All pins are compatible with LVCMOS interface • 4K refresh cycle / 64ms • Programmable Burst Length and Burst Type - 1, 2, 4, 8 or Full Page for Sequential Burst - 4 or 8 for Interleave Burst • Progra | ISSI 矽成半导体 | |||
1M x 16Bits x 4Banks Mobile Synchronous DRAM Features • JEDEC standard 3.3V, 2.5V, 1.8V power supply • Auto refresh and self refresh • All pins are compatible with LVCMOS interface • 4K refresh cycle / 64ms • Programmable Burst Length and Burst Type - 1, 2, 4, 8 or Full Page for Sequential Burst - 4 or 8 for Interleave Burst • Progra | ISSI 矽成半导体 | |||
1M x 16Bits x 4Banks Mobile Synchronous DRAM Features • JEDEC standard 3.3V, 2.5V, 1.8V power supply • Auto refresh and self refresh • All pins are compatible with LVCMOS interface • 4K refresh cycle / 64ms • Programmable Burst Length and Burst Type - 1, 2, 4, 8 or Full Page for Sequential Burst - 4 or 8 for Interleave Burst • Progra | ISSI 矽成半导体 | |||
2M x 16Bits x 4Banks Mobile Synchronous DRAM Features • JEDEC standard 3.3V, 2.5V, 1.8V power supply • Auto refresh and self refresh • All pins are compatible with LVCMOS interface • 4K refresh cycle / 64ms • Programmable Burst Length and Burst Type • 1, 2, 4, 8 or Full Page for Sequential Burst • 4 or 8 for Interleave Burst • Progra | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200,166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
32Meg x 8, 16Meg x16 256Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burs | ISSI 矽成半导体 | |||
64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM OVERVIEW ISSIs 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; | ISSI 矽成半导体 | |||
64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM OVERVIEW ISSIs 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; | ISSI 矽成半导体 | |||
64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM OVERVIEW ISSIs 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. FEATURES • Clock frequency: 166, 143, 133 MHz • Fully synchronous; | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx32, 32Mx16, 64Mx8 512Mb SDRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Prog | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
16Mx8, 8Mx16 128Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply Vdd Vddq IS42/45S81600F 3.3V 3.3V IS42/45S16800F 3.3V 3.3V • LVTTL interface • Programmable burst length – (1 | ISSI 矽成半导体 | |||
512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM OVERVIEW ISSIs 64Mb Synchronous DRAM IS42/45S32200E is organized as 524,288 bits x 32-bit x 4-bank for improved performance. The synchronous DRAMs achieve high speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. GENERAL DES | ISSI 矽成半导体 |
IS45产品属性
- 类型
描述
- 型号
IS45
- 制造商
IDEC Corporation
- 功能描述
SENS.IND. 10-30VDC PNP NC
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ISSI |
1031+ |
BGA |
1450 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
ISSI, Integrated Silicon Solut |
18500 |
全新原厂原装现货!受权代理!可送样可提供技术支持! |
|||||
ISSI |
11+ |
BGA |
33043 |
||||
ISSI |
25+ |
BGA |
4500 |
ISSI存储芯片在售 |
|||
ISSI |
23+ |
60-TFBGA(6.4x10.1) |
73390 |
专业分销产品!原装正品!价格优势! |
|||
IS45S1600J-6CTLA2 |
25+ |
3652 |
3652 |
||||
ISSI |
23+ |
BGA |
12800 |
##公司主营品牌长期供应100%原装现货可含税提供技术 |
|||
ISSI |
24+ |
BGA |
5000 |
全新原装正品,现货销售 |
|||
ISSI/矽成 |
1604 |
SDRAMAUTO-MOBILE/16MX16S |
2335 |
原装香港现货真实库存。低价 |
|||
ISSI, Integrated Silicon Solut |
24+ |
60-迷你型BGA(6.4x10.1) |
56200 |
一级代理/放心采购 |
IS45规格书下载地址
IS45参数引脚图相关
- l101
- l100
- ku波段
- kt250
- kse13005
- ks20
- km710
- ka5q1265rf
- k9f1208
- k310
- k2698
- k233
- k2055
- k2010
- jumper
- jtag接口
- jk触发器
- j111
- j108
- isd1420
- IS-50
- IS4N46
- IS4N45
- IS489
- IS488
- IS487
- IS486
- IS485
- IS482
- IS481
- IS480P
- IS-480
- IS474
- IS471FE
- IS471F
- IS46DR16320C-3DBLA1
- IS46DR16128A-3DBLA2
- IS45S32400F-7TLA1-TR
- IS45S32400E-7TLA2
- IS45S32200L-7TLA2
- IS45S32200L-7BLA2-TR
- IS45S32200E-7TLA2
- IS45S16800F-7TLA1
- IS45S16800F-7CTLA2
- IS45S16800E-7TLA1
- IS45S16400J-7TLA2
- IS45S16400J-7TLA1-TR
- IS45S16400J-7TLA1
- IS45S16400F-7TLA2
- IS45S16400F-7TLA1
- IS45S16320D-7TLA1
- IS45S16320D-7BLA1
- IS45S16160G-7TLA2
- IS45S16160G-7TLA1
- IS45S16160G-7CTLA1
- IS457
- IS456
- IS455
- IS452
- IS450
- IS445
- IS440F
- IS440
- IS43TR85120AL-125KBLI
- IS43TR85120AL-125KBL
- IS43TR85120A-125KBLI
- IS43TR85120A-125KBL
- IS43TR82560B-125KBLI
- IS43TR82560A-15HBLI
- IS43TR81280B-15GBLI
- IS43TR16640AL-125JBLI
- IS43TR16640A-15GBL
- IS43TR16640A-125JBLI
- IS43TR16256AL-15HBLI
- IS43TR16256AL-125KBLI
- IS43TR16256AL-125KBL
- IS43TR16256A-15HBLI
- IS43TR16256A-15HBL
- IS43TR16256A-125KBLI
- IS43TR16256A-125KBL
- IS43TR16128BL-125KBLI
- IS43TR16128B-15HBLI
- IS43TR16128B-15HBL
- IS438
- IS437
- IS436
- IS435
- IS432
- IS431
- IS42SM
- IS423
- IS422
- IS421
- IS420
- IS4100
- IS3H7
- IS3H4
- IS3H&K
- IS3H&J
- IS3H&I
IS45数据表相关新闻
IS45S16320F-7BLA2
IS45S16320F-7BLA2
2023-4-4IS43TR16640B-15GBLI-TR 动态随机存取存储器 1G, 1.5V, DDR3, 64Mx16, 1333MT/s @ 8-8-8, 96 ball BGA (9mm x13mm) RoHS, IT, T&R
原装正品 现货 只做原装
2022-3-30IS43TR16640C-125JBLI 大量到货
IS43TR16640C-125JBLI 大量到货
2021-8-2IS45S16160D-75ETLA1-TR
IS45S16160D-75ETLA1-TR IS43DR82560B-25EBL XC6SLX75-2FGG484I XC6223D181MR-G XC95108-20TQ100I XC6SLX16-3CSG225I CY7C433-20AXC XC6SLX45-2FGG484I LXCRP1C1BL1N LXCRN1C1CL1N XCR3512XL-12PQ208I XC6SLX45-3FGG676I XC7A100T-2CSG324I XC6SLX150T-3CSG484C XC6SLX16-3CSG225I XC7Z030-1FBG676C CY7C
2021-6-2IS45VM16320D-75BLA1
IS45VM16320D-75BLA1
2021-6-2IS43R16800E-5TL公司大量原装正品现货/随时可以发货
瀚佳科技(深圳)有限公司 专业为工厂一站式BOM配单服务
2019-5-9
DdatasheetPDF页码索引
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