采用 DirectFET ™ MP 封装的 30V 单 N 通道 StrongIRFET ™功率 MOSFET

Power MOSFET

文件：270.78 Kbytes Page：9 Pages

RoHs Compliant and Halogen Free

文件：270.78 Kbytes Page：9 Pages

RoHs Compliant and Halogen Free

文件：270.78 Kbytes Page：9 Pages

Benchmark MOSFETs Product Selection Guide

文件：2.62043 Mbytes Page：6 Pages

Power MOSFET

文件：270.78 Kbytes Page：9 Pages

RoHs Compliant and Halogen Free

文件：270.78 Kbytes Page：9 Pages

2/2 or 3/2-way Whisper Valve with media separation

Many fluidic processes moving closer to where they are actually required. In the field of medical devices, for example, treatments such as dialysis can be provided to patients in convenient surroundings at home. Washing units in analytical equipment are positioned on the pipetting arm or direct

Pressure controller for precise time-pressure dosing

Time-pressure dosing is a widely used method for the reliable dosing of liquids across numerous fields of application. However, if dosing quantities are very small and the pressure differences between dosing cycles are minimal, closed-loop control becomes a challenge. Precisely the type of chal

Mass flow controller (MFC)/mass flowmeter (MFM) for gases

The Type 8743 mass flow controller (MFC)/meter (MFM) is suitable for controlling or measuring aggressive gases, gas mixtures and in the area of application for alternating gases. A thermal capillary sensor, with sensor elements not in contact with medium, is used for this. This also enables eas

Mass Dosing Controller (MDC) for liquids

The mass dosing controller (MDC) Type 8756 is especially suitable for dosing small quantities of liquids with the highest accuracy. The measuring principle is based on the Coriolis effect and is completely independent of the medium. Pressure and temperature deviations have no influence on the d

2-way proportional valve with pressure relief

The new proportional valve 2852 is pressure-compensated and therefore offers a high pressure level with low power consumption at the same time. The total dimensions of this valve were kept low with regards to integration in devices where compactness and low heating are required for each individ