Low-profile through-hole (IRF520NL)

Description The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the high est power capability and the lowest pos sible on-resistance in any existing surfa ce mount package. The D2Pak is suitable for high current applications because of its low in

Advanced Process Technology

文件：195.99 Kbytes Page：11 Pages

Isc N-Channel MOSFET Transistor

文件：300.27 Kbytes Page：2 Pages

Advamced {rpcess Technology Surface Mount

Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provide

FAST SWITCHING

文件：414.57 Kbytes Page：11 Pages

ROUND INSTRUMENTATION HANDLES

[KEYSTONE] ROUND INSTRUMENTATION HANDLES FERRULES HANDLE MOUNTING SCREWS

Pentium 4 Processors Supporting Hyper-Threading Technology

Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

횠6.1mm mounting Robust stainless steel housing

文件：423.92 Kbytes Page：5 Pages

MINIATURE FUSEHOLDERS

文件：89.37 Kbytes Page：1 Pages

Sandblast Stencil

文件：15.06 Kbytes Page：2 Pages