IGBT(FRD内置)

FGA65A3H是650V Field Stop型的垂直沟道工艺的IGBT。\n采用了独特的垂直构造减少了寄生容量，既实现低饱和压降，又减少了开关损耗。\nIGBT的低损耗可以实现整机设备的高效率。 ・低饱和电压\n・高速开关\n・内置FRD\n・符合RoHS指令;

VCE = 650 V, IC = 15 A Trench Field Stop IGBT

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N-Channel Enhancement Mode Field Effect Transistor

FEATURES ■ 25V, 45A,RDS(ON) = 12mΩ @VGS = 10V. RDS(ON) = 18mΩ @VGS = 4.5V. ■ Super high dense cell design for extremely low RDS(ON). ■ High power and current handing capability. ■ Lead free product is acquired. ■ TO-220 & TO-263 package.

N-Channel Enhancement Mode Field Effect Transistor

FEATURES ■ 25V, 45A,RDS(ON) = 12mΩ @VGS = 10V. RDS(ON) = 18mΩ @VGS = 4.5V. ■ Super high dense cell design for extremely low RDS(ON). ■ High power and current handing capability. ■ Lead free product is acquired. ■ TO-220 & TO-263 package.

N-Channel Enhancement Mode Field Effect Transistor

VOLTAGE 25 Volts CURRENT 38 Ampere FEATURE * Small package. (TO-252A) * Super high dense cell design for extremely low RDS(ON). * High power and current handing capability. APPLICATION * Servo motor control. * Power MOSFET gate drivers. * Other switching applications.

Trench Field Stop IGBTs with Fast Recovery Diode

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