型号 功能描述 生产厂家&企业 LOGO 操作
DA14531

UltraLowPowerBluetooth5.1SoC

Features ■CompatiblewithBluetoothv5.1,ETSIEN300 328andEN300440Class2(Europe),FCC CFR47Part15(US)andARIBSTD-T66 (Japan) ■SupportsuptothreeBLEconnections ■Typicalcoldboottoradioactive35ms ■Processingpower □16MHz32-bitArm®Cortex-M0+with SWDinterfac

DialogDialog Semiconductor

戴乐格

Dialog

UltraLowPowerBluetooth5.1SoC

Features ■CompatiblewithBluetoothv5.1,ETSIEN300 328andEN300440Class2(Europe),FCC CFR47Part15(US)andARIBSTD-T66 (Japan) ■SupportsuptothreeBLEconnections ■Typicalcoldboottoradioactive35ms ■Processingpower □16MHz32-bitArm®Cortex-M0+with SWDinterfac

DialogDialog Semiconductor

戴乐格

Dialog

UltraLowPowerBluetooth5.1SoC

Features ■CompatiblewithBluetoothv5.1,ETSIEN300 328andEN300440Class2(Europe),FCC CFR47Part15(US)andARIBSTD-T66 (Japan) ■SupportsuptothreeBLEconnections ■Typicalcoldboottoradioactive35ms ■Processingpower □16MHz32-bitArm®Cortex-M0+with SWDinterfac

DialogDialog Semiconductor

戴乐格

Dialog

SmartBondTINYBluetooth®LEModule

▪Bluetooth® •CompatiblewithBluetooth®v5.1, •ETSIEN300328andEN300440Class2 (Europe),FCCCFR47Part15(US)andARIB STD-T66(Japan)core •Supportsuptothreeconnections •RenesasregisteredBDaddresspreprogrammedin OTP ▪Processingandmemories •16MHz32-bitArm®Co

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

RENESAS

SmartBondTINYBluetooth®LEModule

▪Bluetooth® •CompatiblewithBluetooth®v5.1, •ETSIEN300328andEN300440Class2 (Europe),FCCCFR47Part15(US)andARIB STD-T66(Japan)core •Supportsuptothreeconnections •RenesasregisteredBDaddresspreprogrammedin OTP ▪Processingandmemories •16MHz32-bitArm®Co

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

RENESAS

SmartBondTINYBluetooth®LEModule

▪Bluetooth® •CompatiblewithBluetooth®v5.1, •ETSIEN300328andEN300440Class2 (Europe),FCCCFR47Part15(US)andARIB STD-T66(Japan)core •Supportsuptothreeconnections •RenesasregisteredBDaddresspreprogrammedin OTP ▪Processingandmemories •16MHz32-bitArm®Co

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

RENESAS

封装/外壳:17-XFBGA,WLCSP 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:BLE 5.1 SOC WITH ARM CORTEX M0+ RF/IF,射频/中频和 RFID 射频收发器 IC

ETC

知名厂家

包装:散装 描述:BLE DA14531 FCGQFN24 DTR CARD 开发板,套件,编程器 射频评估和开发套件,开发板

ETC

知名厂家

SmartBondTINYTMModule

文件:2.15323 Mbytes Page:32 Pages

DialogDialog Semiconductor

戴乐格

Dialog

SmartBondTINYTMModule

文件:2.15323 Mbytes Page:32 Pages

DialogDialog Semiconductor

戴乐格

Dialog

SmartBondTINYTMModule

文件:2.15323 Mbytes Page:32 Pages

DialogDialog Semiconductor

戴乐格

Dialog

Heyco®-TiteBrassLiquidTightCordgrips

文件:393.02 Kbytes Page:1 Pages

HeycoHeyco.

海科

Heyco

PioneerIoTAdd?륮nShield

文件:227.28 Kbytes Page:2 Pages

SPARKFUN

SparkFun Electronics

SPARKFUN
更新时间:2025-7-30 14:14:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
DIALOG
25+
QFN
32000
DIALOG全新特价DA14531-00000FX2即刻询购立享优惠#长期有货
DIALOG
22+
WFQFN24
6300
只做原装,假一罚百,长期供货。
DIALOG
21+
SOP
19960
现货库存,有单来谈
DIALOG
22+
WFQFN24
8113
原装正品现货假一罚十
Dialog
2113+
FCGQFN-24
20000
原装正品价格优惠,志同道合共谋发展
Dialog Semiconductor GmbH
2023+
Module
4550
全新原装正品
Renesas(瑞萨)
24+
5048
只做原装现货假一罚十!价格最低!只卖原装现货
DIALOG
2021+
QFN40
105000
原装现货,优势渠道订货假一赔十
RENESAS
23+
原封, 支持
10500
RENESAS MCU .IC 元器件供应
DIALOG
2042+
WFQFN24
7825
15年光格 只做原装正品

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