Ultra Low Power Bluetooth 5.1 SoC

Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

SmartBond™ Ultra-Low Power Bluetooth® 5.1 System-on-Chip

Ultra Low Power Bluetooth 5.1 SoC

Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

Ultra Low Power Bluetooth 5.1 SoC

Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

SmartBond TINY Bluetooth® LE Module

▪ Bluetooth® • Compatible with Bluetooth® v5.1, • ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core • Supports up to three connections • Renesas registered BD address preprogrammed in OTP ▪ Processing and memories • 16 MHz 32-bit Arm® Co

SmartBond TINY Bluetooth® LE Module

▪ Bluetooth® • Compatible with Bluetooth® v5.1, • ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core • Supports up to three connections • Renesas registered BD address preprogrammed in OTP ▪ Processing and memories • 16 MHz 32-bit Arm® Co

SmartBond TINY Bluetooth® LE Module

▪ Bluetooth® • Compatible with Bluetooth® v5.1, • ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core • Supports up to three connections • Renesas registered BD address preprogrammed in OTP ▪ Processing and memories • 16 MHz 32-bit Arm® Co

封装/外壳：17-XFBGA，WLCSP 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：BLE 5.1 SOC WITH ARM CORTEX M0+ RF/IF，射频/中频和 RFID 射频收发器 IC

包装：散装 描述：BLE DA14531 FCGQFN24 DTR CARD 开发板，套件，编程器 射频评估和开发套件，开发板

SmartBond TINY™ Bluetooth® Low Energy Module

SmartBond TINYTM Module

文件：2.15323 Mbytes Page：32 Pages

SmartBond TINYTM Module

文件：2.15323 Mbytes Page：32 Pages

SmartBond TINYTM Module

文件：2.15323 Mbytes Page：32 Pages

Heyco®-Tite Brass Liquid Tight Cordgrips

文件：393.02 Kbytes Page：1 Pages

Pioneer IoT Add?륮n Shield

文件：227.28 Kbytes Page：2 Pages