Ultra Low Power Bluetooth 5.1 SoC

Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

封装/外壳：17-XFBGA，WLCSP 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：BLE 5.1 SOC WITH ARM CORTEX M0+ RF/IF，射频/中频和 RFID 射频收发器 IC