CC2640价格
参考价格:¥30.1975
型号:CC2640F128RGZT 品牌:Texas Instruments 备注:这里有CC2640多少钱,2025年最近7天走势,今日出价,今日竞价,CC2640批发/采购报价,CC2640行情走势销售排行榜,CC2640报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CC2640 | CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | ||
CC2640 | 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU | TI 德州仪器 | ||
CC2640 | CC2640 SimpleLink Bluetooth Smart Wireless MCU 文件:1.75518 Mbytes Page:51 Pages | TI 德州仪器 | ||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640 SimpleLink™ Bluetooth® Wireless MCU 1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) • | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | |||
CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | |||
CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® | TI 德州仪器 | |||
CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | |||
CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | |||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | |||
CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | |||
CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | |||
CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 | |||
CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys | TI 德州仪器 |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
24+ |
VQFN48 |
15000 |
原装正品现货 |
|||
TI/德州仪器 |
24+ |
VQFN32 |
9000 |
只做全新原装进口现货 |
|||
TI(德州仪器) |
24+ |
标准封装 |
7348 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
TI/德州仪器 |
25+ |
QFN |
10000 |
就找我吧!--邀您体验愉快问购元件! |
|||
TI/德州仪器 |
25+ |
VQFN-32 |
36000 |
TI/德州仪器全新特价CC2640R2FRHBT即刻询购立享优惠#长期有货 |
|||
TI |
22+ |
QFN |
15000 |
只做原装正品假一赔十!正规渠道订货! |
|||
TI(德州仪器) |
2511 |
N/A |
6000 |
电子元器件采购降本 30%!公司原厂直采,砍掉中间差价 |
|||
TI |
26+ |
WQFN48 |
100000 |
全新原装正品代理渠道,假一赔十 |
|||
TI |
23+ |
VQFN48 |
18000 |
仓库现货,下单就发货 |
|||
TI/德州仪器 |
24+ |
VQFN32 |
212950 |
原装现货/15年行业经验欢迎询价 |
CC2640芯片相关品牌
CC2640规格书下载地址
CC2640参数引脚图相关
- cw7805
- cs5532
- cs1
- cpld
- cp10
- connector
- cob
- cmos传感器
- cmos
- cm2006
- cicret
- cd4543
- cd4066
- cd4051
- cd4046
- cd4011
- CCFL
- ccd图像传感器
- ccd传感器
- CCD
- CC3130
- CC3120
- CC3100
- CC3000
- CC2D35S
- CC2D35
- CC2D33S
- CC2D33
- CC2D25S
- CC2D25
- CC2D23S
- CC2D23
- CC2A35
- CC2A33
- CC2A25
- CC2A23
- CC2824J502R-10
- CC2824E513R-10
- CC2824E474R-10
- CC2824E253R-10
- CC2824D225R-10
- CC2824B475R-10
- CC2652R
- CC2652P
- CC2650STK
- CC2650F128RSMT
- CC2650F128RHBT
- CC2650F128RGZT
- CC2650EMK-7ID
- CC2650EMK-5XD
- CC2650EMK-4XS
- CC2650DK
- CC2650
- CC2644-000
- CC2642R
- CC2640F128RSMT
- CC2640F128RSMR
- CC2640F128RHBT
- CC2640F128RGZT
- CC2630F128RSMT
- CC2630F128RHBT
- CC2630F128RGZT
- CC2630
- CC2620
- CC2619-000
- CC25TTE
- CC25-BLACK
- CC2595RGTT
- CC2595RGTR
- CC2595
- CC2592RGVT
- CC2592RGVR
- CC2592
- CC2591RGVTG4
- CC2591RGVT
- CC2591RGVR
- CC2591
- CC2590RGVT
- CC2590RGVR
- CC2590
- CC2571RHAT
- CC2571
- CC2570RHAT
- CC2570
- CC256XQFNEM
- CC256XEM-STADAPT
- CC256X
- CC2564YFVT
- CC2564YFVR
- CC2564C
- CC2564B
- CC2564
- CC2560B
- CC2560A
- CC2560
- CC2550
- CC2545
- CC2544
- CC2543
CC2640数据表相关新闻
CC2592RGVR
CC2592RGVR
2025-3-25CC2640R2FRHBR
CC2640R2FRHBR
2023-8-21CC2640R2FRGZR
CC2640R2FRGZR 原装正品,支持实单
2022-8-23CC2591RGVR
所有产品 半导体 无线和射频集成电路 射频前端 Texas Instruments CC2591RGVR
2021-9-18CC2640F128RHBR针对蓝牙智能应用的SimpleLink超低功耗无线MCU
原装正品,价格优势,竭力为您服务 0755-88600196/QQ3007281353
2019-6-24CC2591RGVR2.4GHz范围扩展器
原装正品,价格优势,竭力为您服务 0755-88600196/QQ3007281353
2019-6-24
DdatasheetPDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107