型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
---|---|---|---|---|
CC1312R | CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1312R | CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | ||
CC1312R | CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | ||
CC1312R | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1312R | CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1312R | CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | ||
CC1312R | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC1312R | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC1312R | CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC1312R | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC1312R | 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低于 1GHz 无线 MCU | TI 德州仪器 | ||
CC1312R | SimpleLink High-Performance Sub-1 GHz Wireless MCU 文件:550.88 Kbytes Page:48 Pages | TI 德州仪器 | ||
CC1312R | CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.90059 Mbytes Page:58 Pages | TI 德州仪器 | ||
CC1312R | CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | ||
CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | |||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | |||
CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | |||
CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
SimpleLink High-Performance Sub-1 GHz Wireless MCU 文件:550.88 Kbytes Page:48 Pages | TI 德州仪器 | |||
SimpleLink High-Performance Sub-1 GHz Wireless MCU 文件:550.88 Kbytes Page:48 Pages | TI 德州仪器 | |||
封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:WIRELESS COMMUNICATION RF/IF,射频/中频和 RFID 射频收发器 IC | TI2 德州仪器 | |||
SimpleLink High-Performance Sub-1 GHz Wireless MCU 文件:550.88 Kbytes Page:48 Pages | TI 德州仪器 | |||
封装/外壳:48-VFQFN 裸露焊盘 包装:管件 描述:WIRELESS COMMUNICATION RF/IF,射频/中频和 RFID 射频收发器 IC | TI2 德州仪器 | |||
CC1312R7 SimpleLink??High-Performance Sub-1 GHz Wireless MCU 文件:3.16744 Mbytes Page:58 Pages | TI 德州仪器 | |||
CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | |||
CC1312R7 SimpleLink??High-Performance Sub-1 GHz Wireless MCU 文件:3.16744 Mbytes Page:58 Pages | TI 德州仪器 | |||
Speaker Cable, 4 C #12 Str BC-OFHC, PVC Jkt, CM, DIR BUR, Flexible Product Description Speaker Cable, 4 Conductor 12 AWG (168 x 34) Oxygen-Free Bare Copper (High Conductivity), PE Insulation, PVC Jacket, CM, Direct Burial, Flexible | BELDEN 百通 | |||
Precise temperature control 文件:538.07 Kbytes Page:2 Pages | LSTD 莱尔德 | |||
Precise temperature control 文件:563.92 Kbytes Page:2 Pages | LSTD 莱尔德 | |||
Window “View Port” Plugs 文件:120.92 Kbytes Page:1 Pages | Heyco | |||
Window “View Port” Plugs 文件:120.92 Kbytes Page:1 Pages | Heyco |
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI |
24+ |
VQFN48 |
8000 |
新到现货,只做全新原装正品 |
|||
TI(德州仪器) |
24+ |
标准封装 |
7219 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
TI |
24+ |
QFN48 |
28900 |
只做原装正品,公司现货 |
|||
TI(德州仪器) |
24+ |
QFN-48 |
12048 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
|||
TI/德州仪器 |
2023+ |
VQFN48 |
7000 |
原厂全新正品旗舰店优势现货 |
|||
TI/德州仪器 |
25+ |
QFN |
54658 |
百分百原装现货 实单必成 |
|||
TI/德州仪器 |
22+ |
QFN |
100000 |
代理渠道/只做原装/可含税 |
|||
Texas Instruments |
24+ |
VQFN-48 |
3265 |
全新原厂原装,进口正品现货,正规渠道可含税!! |
|||
TI |
25+ |
VQFN48 |
13000 |
全新原装现货,欢迎询购! |
|||
TI(德州仪器) |
2450+ |
SMD |
9850 |
只做原装正品代理渠道!假一赔三! |
CC1312R规格书下载地址
CC1312R参数引脚图相关
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- cs5532
- cs1
- cpld
- cp10
- connector
- cob
- cmos传感器
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- cm2006
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- cd4543
- cd4066
- cd4051
- cd4046
- cd4011
- CCFL
- ccd图像传感器
- ccd传感器
- CCD
- CC2400
- CC22K2
- CC2220
- CC20TTE
- CC2036
- CC2024
- CC2016B
- CC1V_16
- CC1-N
- CC1F_16
- CC1A_16
- CC1812
- CC1808
- CC-18
- CC154
- CC1512
- CC14633
- CC1352R
- CC1352P
- CC1350F128RGZT
- CC1350F128RGZR
- CC1350F128RGZ
- CC1350_16
- CC1350
- CC1340M8M
- CC1340M3M
- CC1320R8M
- CC1320R3M
- CC1314R106T0RSKR
- CC1314R106T0RSK
- CC1314R106T0RGZR
- CC1314R106T0RGZ
- CC1314R10_V01
- CC1314R10
- CC1312R74T0RGZR
- CC1312R7
- CC1312R1F3RGZT
- CC1312R1F3RGZR
- CC1312R1F3RGZ
- CC1312PSIPMOTR
- CC1312PSIPMOT
- CC1312PSIP
- CC1311R31T0RKPR
- CC1311R31T0RGZR
- CC1311R3
- CC1311P31T0RGZR
- CC1311P3
- CC1310F64RSMT
- CC1310F64RSMR
- CC1310F64RHBT
- CC1310F64RHBR
- CC1310F64RGZT
- CC1310F64RGZR
- CC1310F32RSMT
- CC1310F32RSMR
- CC1310F32RHBT
- CC1310F32RHBR
- CC1310F32RGZT
- CC1310F32RGZR
- CC1310
- CC13052
- CC12TTE
- CC12K2
- CC12H8A
- CC12H7A
- CC12H6A
- CC12H5A
- CC12H4A
- CC12H3A
- CC12H2A
- CC12H1A
- CC12H
- CC1240R
- CC1216
- CC1210
- CC1206
- CC1201
- CC1200
- CC11K0
CC1312R数据表相关新闻
CC1310F128RSMR
CC1310F128RSMR
2023-10-25CC2400-RTB1
CC2400-RTB1
2023-4-25CC1310F128RSMR 射频微控制器
CC1310F128RSMR 射频微控制器 - MCU 433 868 915 MHz ULP Wireless MCU
2023-2-23CC1310F32RSMT
CC1310F32RSMT
2021-10-29CC2500RGPR假一罚十
只做原装正品,原包装标签 欢迎咨询!
2021-4-13CC2500RGPRM24C64-FMB6TG原装正品,价格优势
原装正品, 价格优势 我们竭诚为您服务 13342971909 吴小姐
2019-3-8
DdatasheetPDF页码索引
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