型号 功能描述 生产厂家 企业 LOGO 操作
CC1312R

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1312R

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC1312R

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC1312R

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1312R

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC1312R

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

TI

德州仪器

CC1312R

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC1312R

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC1312R

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC1312R

CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

TI

德州仪器

CC1312R

CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC1312R

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1312R

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1312R

CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC1312R

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC1312R

具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低于 1GHz 无线 MCU

TI

德州仪器

CC1312R

SimpleLink High-Performance Sub-1 GHz Wireless MCU

文件:550.88 Kbytes Page:48 Pages

TI

德州仪器

CC1312R

CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU

文件:2.90059 Mbytes Page:58 Pages

TI

德州仪器

CC1312R

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

TI

德州仪器

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI

德州仪器

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

TI

德州仪器

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

TI

德州仪器

CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

TI

德州仪器

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI

德州仪器

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

SimpleLink High-Performance Sub-1 GHz Wireless MCU

文件:550.88 Kbytes Page:48 Pages

TI

德州仪器

SimpleLink High-Performance Sub-1 GHz Wireless MCU

文件:550.88 Kbytes Page:48 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:WIRELESS COMMUNICATION RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink High-Performance Sub-1 GHz Wireless MCU

文件:550.88 Kbytes Page:48 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:管件 描述:WIRELESS COMMUNICATION RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC1312R7 SimpleLink??High-Performance Sub-1 GHz Wireless MCU

文件:3.16744 Mbytes Page:58 Pages

TI

德州仪器

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

CC1312R7 SimpleLink??High-Performance Sub-1 GHz Wireless MCU

文件:3.16744 Mbytes Page:58 Pages

TI

德州仪器

Speaker Cable, 4 C #12 Str BC-OFHC, PVC Jkt, CM, DIR BUR, Flexible

Product Description Speaker Cable, 4 Conductor 12 AWG (168 x 34) Oxygen-Free Bare Copper (High Conductivity), PE Insulation, PVC Jacket, CM, Direct Burial, Flexible

BELDEN

百通

Precise temperature control

文件:538.07 Kbytes Page:2 Pages

LSTD

莱尔德

Precise temperature control

文件:563.92 Kbytes Page:2 Pages

LSTD

莱尔德

Window “View Port” Plugs

文件:120.92 Kbytes Page:1 Pages

Heyco

Window “View Port” Plugs

文件:120.92 Kbytes Page:1 Pages

Heyco

更新时间:2025-12-17 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
标准封装
7219
原厂直销,大量现货库存,交期快。价格优,支持账期
TI(德州仪器)
24+
QFN-48
12048
原厂可订货,技术支持,直接渠道。可签保供合同
TI
23+
N/A
25000
只做原装,可直接咨询
TI
24+
QFN48
28900
只做原装正品,公司现货
TI/德州仪器
22+
QFN
100000
代理渠道/只做原装/可含税
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI/德州仪器
25+
VQFN24
32000
TI/德州仪器全新特价CC1312R1F3RGZR即刻询购立享优惠#长期有货
TI
23+
QFN48
24500
交个朋友支持实单
TI/德州仪器
22+
VQFN48
3000
原装正品现货
TI(德州仪器)
2526+
VQFN-48
50000
只做原装优势现货库存,渠道可追溯

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