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型号	功能描述	生产厂家&企业
CC1312R	CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R	CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	SimpleLinkHigh-PerformanceSub-1GHzWirelessMCU 文件：550.88 Kbytes Page：48 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2652R7SimpleLink??Multiprotocol2.4GHzWirelessMCU 文件：2.90059 Mbytes Page：58 Pages	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R	CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier 文件：3.51768 Mbytes Page：63 Pages	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R1F3RGZ	SimpleLinkHigh-PerformanceSub-1GHzWirelessMCU 文件：550.88 Kbytes Page：48 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R1F3RGZR	SimpleLinkHigh-PerformanceSub-1GHzWirelessMCU 文件：550.88 Kbytes Page：48 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R1F3RGZR	封装/外壳：48-VFQFN 裸露焊盘包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带描述：WIRELESS COMMUNICATION RF/IF，射频/中频和 RFID 射频收发器 IC	TI2Texas Instruments 德州仪器美国德州仪器公司
CC1312R1F3RGZT	封装/外壳：48-VFQFN 裸露焊盘包装：管件描述：WIRELESS COMMUNICATION RF/IF，射频/中频和 RFID 射频收发器 IC	TI2Texas Instruments 德州仪器美国德州仪器公司
CC1312R1F3RGZT	SimpleLinkHigh-PerformanceSub-1GHzWirelessMCU 文件：550.88 Kbytes Page：48 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC1312R7SimpleLink??High-PerformanceSub-1GHzWirelessMCU 文件：3.16744 Mbytes Page：58 Pages	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R7	CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier 文件：3.51768 Mbytes Page：63 Pages	TITexas Instruments 德州仪器美国德州仪器公司
CC1312R74T0RGZR	CC1312R7SimpleLink??High-PerformanceSub-1GHzWirelessMCU 文件：3.16744 Mbytes Page：58 Pages	TITexas Instruments 德州仪器美国德州仪器公司
1312A	SpeakerCable,4C#12StrBC-OFHC,PVCJkt,CM,DIRBUR,Flexible ProductDescription SpeakerCable,4Conductor12AWG(168x34)Oxygen-FreeBareCopper(HighConductivity),PEInsulation,PVCJacket,CM,DirectBurial,Flexible	BELDENBelden Inc. 百通电缆设计科技有限公司
1312	Precisetemperaturecontrol 文件：538.07 Kbytes Page：2 Pages	LSTD Laird Tech Smart Technology
1312	Precisetemperaturecontrol 文件：563.92 Kbytes Page：2 Pages	LSTD Laird Tech Smart Technology
1312	Window“ViewPort”Plugs 文件：120.92 Kbytes Page：1 Pages	HeycoHeyco. 海科
1312D	Window“ViewPort”Plugs 文件：120.92 Kbytes Page：1 Pages	HeycoHeyco. 海科

CC1312R供应商更多...

更新时间：2025-6-26 14:30:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市联世界科技有限公司	CC1312R1F3RGZR	TI(德州仪器)	24+/25+		10000	原装正品现货库存价优	询价
深圳市英卓尔科技有限公司	CC1312R74T0RGZR	TI/德州仪器	22+	VQFN48	3000	原装正品现货	询价
中天科工半导体（深圳）有限公司	CC1312R1F3RGZR	TI(德州仪器)	24+	标准	32092	热卖原装进口	询价
深圳市科恒伟业电子有限公司	CC1312R1F3RGZR	TI	21+	VQFN	9850	只做原装正品假一赔十!正规渠道订货!	询价
中科国际电子(深圳)有限公司	CC1312R1F3RGZR	TI(德州仪器)	22+	NA	6000	原厂原装现货	询价
深圳市芯巴巴科技有限公司	CC1312R1F3RGZR	TI	24+	VQFN48	10000	只做原装现货假一赔万	询价
深圳信泰电子器材有限公司	CC1312R1F3RGZR	TI/德州仪器	24+	VQFN48	5000	全新原装正品现货,以优势说话 !	询价
深圳市恒达亿科技有限公司	CC1312R1F3RGZR	TI	23+	VQFN48	13000	全新原装现货，欢迎询购！	询价
深圳市威雅利发展有限公司	CC1312R1F3RGZR	TI 主营CC系列	21+	VQFN48	6894	一级代理,专注军工、汽车、医疗、工业、新能源、电力	询价
深圳市兴灿科技有限公司	CC1312R1F3RGZR	TI/德州仪器	24+	VQFN-48	25500	授权代理直销,原厂原装现货,假一罚十,特价销售	询价

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CC1312R芯片相关品牌

CC1312R规格书下载地址

CC1312R参数引脚图相关

CC1312R数据表相关新闻

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DdatasheetPDF页码索引