73M2901CE-IGV价格

参考价格:¥23.2285

型号:73M2901CE-IGV/F 品牌:Maxim 备注:这里有73M2901CE-IGV多少钱,2025年最近7天走势,今日出价,今日竞价,73M2901CE-IGV批发/采购报价,73M2901CE-IGV行情走势销售排行榜,73M2901CE-IGV报价。
型号 功能描述 生产厂家 企业 LOGO 操作

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

东电化

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

73M2901CE-IGV产品属性

  • 类型

    描述

  • 型号

    73M2901CE-IGV

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2025-12-31 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MAXIM/美信
25+
QFP32
54658
百分百原装现货 实单必成
TDK
24+
PLCC
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
SIPEX
2016+
PLCC
8760
只做原装,假一罚十,公司可开17%增值税发票!
TDK/东电化
25+
PLCC
32360
TDK/东电化全新特价73M2901-32IH即刻询购立享优惠#长期有货
TDK
25+
SOP
3200
全新原装、诚信经营、公司现货销售
TDK(东电化)
2021/2022+
标准封装
40000
原厂原装现货订货价格优势终端BOM表可配单提供样品
MAXIM/美信
22+
明嘉莱只做原装正品现货
2510000
TQFP-32
Maxim(美信)
24+
32-TQFP
10048
原厂可订货,技术支持,直接渠道。可签保供合同
Maxim(美信)
24+
标准封装
22366
原厂渠道供应,大量现货,原型号开票。
TDK
22+
PLCC32P
20000
公司只有原装 品质保证

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