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73M2901CE-IGV价格
参考价格:¥23.2285
型号:73M2901CE-IGV/F 品牌:Maxim 备注:这里有73M2901CE-IGV多少钱,2026年最近7天走势,今日出价,今日竞价,73M2901CE-IGV批发/采购报价,73M2901CE-IGV行情走势销售排行榜,73M2901CE-IGV报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN | |||
Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN | |||
Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN | |||
V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN | |||
Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN | |||
V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN | |||
V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN | |||
Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN | |||
封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块 | AD 亚德诺 | |||
封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块 | AD 亚德诺 | |||
Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie | TDK 东电化 | |||
V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as | TDK 东电化 | |||
V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as | TDK 东电化 | |||
V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as | TDK 东电化 | |||
V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as | TDK 东电化 |
73M2901CE-IGV产品属性
- 类型
描述
- 型号
73M2901CE-IGV
- 功能描述
电信线路管理 IC V.22bis Single-Chip Modem
- RoHS
否
- 制造商
STMicroelectronics
- 产品
PHY
- 接口类型
UART
- 电源电压-最大
18 V
- 电源电压-最小
8 V
- 电源电流
30 mA
- 最大工作温度
+ 85 C
- 最小工作温度
- 40 C
- 安装风格
SMD/SMT
- 封装/箱体
VFQFPN-48
- 封装
Tray
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ADI(亚德诺) |
25+ |
N/A |
22412 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
MAXIM |
24+ |
TQFP32 |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
|||
MAXIM |
14+ |
TQFP32 |
34 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
MAXIM/美信 |
23+ |
TQFP-32 |
12700 |
买原装认准中赛美 |
|||
TERIDIAN |
2450+ |
TQFP32 |
8850 |
只做原装正品假一赔十为客户做到零风险!! |
|||
TERIDIAN |
23+ |
QFP32 |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
TERIDIAN |
10+ |
TQFP32 |
750 |
原装现货 |
|||
Maxim(美信) |
26+ |
NA |
60000 |
只有原装 ,可BOM配单 |
|||
MAXIM/美信 |
23+ |
TQFP-32 |
5000 |
全新原装现货 |
|||
MAXIM/美信 |
22+ |
明嘉莱只做原装正品现货 |
2510000 |
TQFP-32 |
73M2901CE-IGV芯片相关品牌
73M2901CE-IGV规格书下载地址
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DdatasheetPDF页码索引
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