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66AK价格

参考价格：￥4944.1191

型号：66AK2H12BAAWA2 品牌：Texas Instruments 备注：这里有66AK多少钱，2026年最近7天走势，今日出价，今日竞价，66AK批发/采购报价，66AK行情走势销售排行榜，66AK报价。

型号	功能描述	生产厂家企业	LOGO
66AK2G12ABY100	丝印代码：66AK2G12ABY100742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G12ABY60	丝印代码：66AK2G12ABY60742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G12ABYA100	丝印代码：66AK2G12ABYA100742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G12ABYA100E	丝印代码：66AK2G12ABYA100E742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G12ABYA60	丝印代码：66AK2G12ABYA60742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G12ABYA60E	丝印代码：66AK2G12ABYA60E742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G12ABYT100	丝印代码：66AK2G12ABYT100742ABY；66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2H06DAAW2	丝印代码：66AK2H06AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06DAAW24	丝印代码：66AK2H06AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06DAAWA2	丝印代码：66AK2H06AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06DAAWA24	丝印代码：66AK2H06AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAW2	丝印代码：66AK2H12AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAW24	丝印代码：66AK2H12AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAWA2	丝印代码：66AK2H12AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAWA24	丝印代码：66AK2H12AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DXAAWA24	丝印代码：66AK2H12XAAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H14DAAW24	丝印代码：66AK2H14AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H14DAAWA24	丝印代码：66AK2H14AAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H14DXAAWA24	丝印代码：66AK2H14XAAW；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12BAAWA24	丝印代码：66AK2H12AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H12BXAAW2	丝印代码：66AK2H12XAAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H12DAAW2	丝印代码：66AK2H12AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H12DAAW24	丝印代码：66AK2H12AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H12DAAWA2	丝印代码：66AK2H12AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H12DAAWA24	丝印代码：66AK2H12AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H12DXAAWA24	丝印代码：66AK2H12XAAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H14BAAW24	丝印代码：66AK2H14AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H14BAAWA24	丝印代码：66AK2H14AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H14BXAAW24	丝印代码：66AK2H14XAAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H14DAAW24	丝印代码：66AK2H14AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H14DAAWA24	丝印代码：66AK2H14AAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2H14DXAAWA24	丝印代码：66AK2H14XAAW；Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.83 Mbytes Page：329 Pages	TI 德州仪器	TI
66AK2G01	Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 66AK2G0x is a family of heterogeneous multicore System-on-Chip (SoC) devicesbased on TI’s field-proven Keystone II (KS2) architecture. These devices address applications thatrequire both DSP and ARM performance, with integration of high-speed peripheral and memoryinterfaces, hardware acceleration fo ·Processor Cores:\n·ARM® Cortex®-A15 Microprocessor Unit (ARM A15) Subsystem at up to 600 MHz·Supports Full Implementation of ARMv7-AArchitecture Instruction Set\n·Integrated SIMDv2 (NEON™ Technology) and VFPv4 (Vector FloatingPoint)\n·32KB of L1 Program Memory \n·32KB of L1 Data Memory\n·512KB of L;	TI 德州仪器	TI
66AK2G02	66AK2G02 66AK2G0x is a family of heterogeneous multicore System-on-Chip (SoC) devicesbased on TI’s field-proven Keystone II (KS2) architecture. These devices address applications thatrequire both DSP and ARM performance, with integration of high-speed peripheral and memoryinterfaces, hardware acceleration fo ·Processor Cores:\n·ARM® Cortex®-A15 Microprocessor Unit (ARM A15) Subsystem at up to 600 MHz·Supports Full Implementation of ARMv7-AArchitecture Instruction Set\n·Integrated SIMDv2 (NEON™ Technology) and VFPv4 (Vector FloatingPoint)\n·32KB of L1 Program Memory \n·32KB of L1 Data Memory\n·512KB of L;	TI 德州仪器	TI
66AK2G12	高性能多核 DSP+Arm - 1 个 Arm A15 内核、1 个 C66x DSP 内核 66AK2G1x 是基于 TI 经实践检验的 Keystone II (KS2) 架构的异构多核片上系统 (SoC) 器件系列。这些器件适用于需要 DSP 和 Arm 性能的应用，集成了高速外设和存储器接口、针对网络和加密功能的硬件加速以及高级操作系统 (HLOS) 支持。\n\n66AK2G1x 与基于 KS2 的现有 SoC 器件类似，使 DSP 和 Arm 内核能够控制系统中的所有存储器和外设。此架构有助于最大限度地提高软件灵活性，可以实现以 DSP 或 Arm 为中心的系统设计。\n\n66AK2G1x 通过在处理器内核、共享存储器、模块中的嵌入式存储器和外部存储器接口中广泛实现错 • 处理器内核：\n• 支持完全实现 Armv7-A 架构指令集\n• 32KB 的 L1 程序存储器 \n• 512KB 的 L2 存储器 \n• 用于 L1 程序存储器的奇偶校验保护\n• 用于为 Arm A15 内部计时器提供时基的 64 位自由运行计数器 \n• 频率高达 1000MHz 的 C66x 定点和浮点 VLIW DSP 子系统 \n• 32KB 的 L1 程序存储器 \n• 1024KB 的 L2，可配置为 L2 RAM 或缓存 \n• 用于 L1 数据存储器的 ECC\n• 工业子系统：\n• 两个具有增强型乘法器和累加器的可编程实时单元 (PRU)，每个 PRU 支持：;	TI 德州仪器	TI
66AK2G12ABYT100.Z	66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2G1X	66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3	TI 德州仪器	TI
66AK2H05DAAW2.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06DAAW2.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06DAAW24.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H06DAAWA2.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAW2.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAW24.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAWA2.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H12DAAWA24.Z	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2H14	66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core	TI 德州仪器	TI
66AK2E02	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E02	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E02	Applications of the K2H and K2E platforms in high-end imaging 文件：520.73 Kbytes Page：4 Pages	TI 德州仪器	TI
66AK2E02ABDA4	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E02ABDA4	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E05	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E05	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E05	Applications of the K2H and K2E platforms in high-end imaging 文件：520.73 Kbytes Page：4 Pages	TI 德州仪器	TI
66AK2E05_15	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E05_16	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E05XABD25	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages	TI 德州仪器	TI
66AK2E05XABD25	66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages	TI 德州仪器	TI

66AK产品属性

类型
描述
Operating Systems：
Integrity; Linux; SYS/BIOS; VxWorks
ARM CPU：
1 ARM Cortex-A15
ARM MHz (Max.)：
1250; 1400
DSP：
1 C66x
DSP MHz (Max.)：
1250; 1400
Hardware Accelerators：
Security Accelerator
Other On-Chip Memory：
2048 KB
DRAM：
DDR3; DDR3L
EMAC：
2-Port 10Gb Switch; 8-Port 1Gb Switch
JESD204B：
0
Operating Temperature Range (C)：
-40 to 100
PCI/PCIe：
4 PCIe Gen2
On-Chip L2 Cache/RAM：
4096 KB (ARM Cluster); 512 KB (per C66x DSP core)
USB：
2
SPI：
3
I2C：
3
UART (SCI)：
2

66AK供应商更多...

更新时间：2026-5-23 18:00:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市冠亿通科技有限公司	66AK2E02ABDA4	Texas Instruments			18500	全新原厂原装现货!受权代理!可送样可提供技术支持!	询价
中天科工半导体（深圳）有限公司	66AK2H06DAAW24	Texas Instruments	20+	FCBGA-1517	15988	TI全新DSP-可开原型号增税票	询价
瀚佳科技(深圳)有限公司	66AK2H06DAAW24	Texas Instruments	24+	-	56300	一级代理/放心采购	询价
深圳市明嘉莱科技有限公司	66AK2E05XABD4	TI/德州仪器	25+	FCBGA-1089	880000	明嘉莱只做原装正品现货	询价
深圳市科恒伟业电子有限公司	66AH1	N/A	2450+	QFN	9850	只做原厂原装正品现货或订货假一赔十!	询价
深圳市恒达亿科技有限公司	66A031	penbex	25+	QFP	4500	全新原装、诚信经营、公司现货销售	询价
标准国际(香港)有限公司	66AH	66AH	25+	2956	2956		询价
深圳市河锋鑫科技有限公司	66AK2E02ABDA4	TI	22+		9000	原厂渠道,现货配单	询价
深圳市纳立科技有限公司	66AK2H06DAAW24	TI	三年内		1983	只做原装正品	询价
深圳市得捷芯城科技有限公司	66AK2H06DAAW2	TI	25+	FCBGA-1517(40x40)	22412	正规渠道,免费送样。支持账期,BOM一站式配齐	询价

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66AK芯片相关品牌

66AK规格书下载地址

66AK参数引脚图相关

66AK数据表相关新闻

68129保证原装正品，只做原装

6750BL14A0050001T转换器

66597-8

65100516121

657-2485-303F 全新原装正品 现货

670-2614-2-ND连接器 端子原装正品现货670-2614-2-ND产品资料

DdatasheetPDF页码索引

657-2485-303F 全新原装正品现货

670-2614-2-ND连接器端子原装正品现货670-2614-2-ND产品资料