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66AK价格
参考价格：￥4944.1191
型号：66AK2H12BAAWA2 品牌：Texas Instruments 备注：这里有66AK多少钱，2025年最近7天走势，今日出价，今日竞价，66AK批发/采购报价，66AK行情走势销售排行榜，66AK报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 |   | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2G1x Multicore DSPArm KeyStone II System-on-Chip (SoC) 1.1 Features 1Processor cores: • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz – Supports full Implementation of Armv7-A architecture instruction set – Integrated SIMDv2 ( Arm® Neon™ Technology) and VFPv4 (Vector Floating Point) – 32KB of L1 program memory – 3 | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) 1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core | TI 德州仪器 | | ||
Applications of the K2H and K2E platforms in high-end imaging 文件：520.73 Kbytes Page：4 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
Applications of the K2H and K2E platforms in high-end imaging 文件：520.73 Kbytes Page：4 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
封装/外壳：1089-BFBGA，FCBGA 包装：托盘 描述：IC DSP ARM SOC 1089FCBGA 集成电路（IC） DSP（数字信号处理器） | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：1.5469 Mbytes Page：282 Pages | TI 德州仪器 | | ||
66AK2E0x Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.02919 Mbytes Page：282 Pages | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.45495 Mbytes Page：230 Pages | TI 德州仪器 | | ||
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) | TI 德州仪器 | | ||
66AK2G02 | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip 文件：2.41686 Mbytes Page：240 Pages | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.45495 Mbytes Page：230 Pages | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.45495 Mbytes Page：230 Pages | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.45495 Mbytes Page：230 Pages | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.37257 Mbytes Page：231 Pages | TI 德州仪器 | | ||
Multicore DSPARM KeyStone II System-on-Chip (SoC) 文件：2.06013 Mbytes Page：230 Pages | TI 德州仪器 | |
66AK产品属性
- 类型
描述
- 型号
66AK
- 制造商
Texas Instruments
- 功能描述
KEPLER 1.1 - Trays
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
2020+ |
原装现货 |
9000 |
只做原装，可提供样品 |
|||
TI(德州仪器) |
25+ |
原装 |
12800 |
TI/德州仪器全新66AK2G12ABY100即刻询购立享优惠#数字信号处理器DSP |
|||
TI |
25+ |
FCBGA (ABY) |
6000 |
原厂原装,价格优势 |
|||
TI(德州仪器) |
2447 |
FCBGA-625(21x21) |
31500 |
60个/托盘一级代理专营品牌!原装正品,优势现货,长 |
|||
TI(德州仪器) |
24+ |
FCBGA-625 |
949 |
深耕行业12年,可提供技术支持。 |
|||
Texas |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
||||
TI(德州仪器) |
2021+ |
FCBGA-625(21x21) |
499 |
||||
TI(德州仪器) |
2511 |
FCBGA-625(21x21) |
8790 |
电子元器件采购降本30%!原厂直采,砍掉中间差价 |
|||
TI(德州仪器) |
23+ |
FCBGA-625(21x21) |
13650 |
公司只做原装正品,假一赔十 |
|||
24+ |
N/A |
52000 |
一级代理-主营优势-实惠价格-不悔选择 |
66AK芯片相关品牌
66AK规格书下载地址
66AK参数引脚图相关
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66AK数据表相关新闻
68129保证原装正品，只做原装
68129保证原装正品，只做原装
2024-7-316750BL14A0050001T转换器
Johanson 的滤波器具有宽通带和更小的占用空间，适用于低延迟、多点和速度更快的无线路由器
2024-3-1966597-8
进口代理
2023-12-2165100516121
65100516121
2022-12-15657-2485-303F 全新原装正品 现货
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670-2614-2-ND连接器 端子原装正品现货670-2614-2-ND产品资料
2020-5-15
DdatasheetPDF页码索引
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- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
