1.1 Features 1

• Eight TMS320C66x DSP Core Subsystems (C66x

CorePacs), Each With

– 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-

Point DSP Core

– 38.4 GMacs/Core for Fixed Point @ 1.2 GHz

– 19.2 GFlops/Core for Floating Point @ 1.2

GHz

– Memory

– 32-KB L1P Per CorePac

– 32-KB L1D Per CorePac

– 1024-KB Local L2 Per CorePac

• ARM CorePac

– Four ARM® Cortex®-A15 MPCore™ Processors

at up to 1.4 GHz

– 4MB of L2 Cache Memory Shared by Four ARM

Cores

– Full Implementation of ARMv7-A Architecture

Instruction Set

– 32-KB L1 Instruction and Data Caches per Core

– AMBA 4.0 AXI Coherency Extension (ACE)

Master Port, Connected to MSMC for Low-

Latency Access to Shared MSMC SRAM

• Multicore Shared Memory Controller (MSMC)

– 6MB of MSM SRAM Memory Shared by Eight

DSP CorePacs and One ARM CorePac

– Memory Protection Unit (MPU) for Both MSM

SRAM and DDR3_EMIF

• Multicore Navigator

– 16k Multipurpose Hardware Queues With

Queue Manager

– Packet-Based DMA for Zero-Overhead

Transfers

• Network Coprocessor

– Packet Accelerator Enables Support for

– Transport Plane IPsec, GTP-U, SCTP, PDCP

– L2 User Plane PDCP (RoHC, Air Ciphering)

– 1-Gbps Wire Speed Throughput at 1.5

MPackets Per Second

– Security Accelerator Engine Enables Support for

– IPSec, SRTP, 3GPP, and WiMAX Air

Interface, and SSL/TLS Security

– ECB, CBC, CTR, F8, A5/3, CCM, GCM,

HMAC, CMAC, GMAC, AES, DES, 3DES,

Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit

Hash), MD5

– Up to 2.4 Gbps IPSec and 2.4 Gbps Air

Ciphering

– Ethernet Subsystem

– Five-Port Switch (Four SGMII Ports)

• Peripherals

– Four Lanes of SRIO 2.1

– Supports up to 5 GBaud

– Supports Direct I/O, Message Passing

– Two Lanes PCIe Gen2

– Supports up to 5 GBaud

– Two HyperLinks

– Supports Connections to Other KeyStone™

Architecture Devices Providing Resource

Scalability

– Supports up to 50 GBaud

– 10-Gigabit Ethernet (10-GbE) Switch Subsystem

(66AK2H14 Only)

– Two XFI Ports

– IEEE 1588 Support

– Five Enhanced Direct Memory Access (EDMA)

Modules

– Two 72-Bit DDR3/DDR3L Interfaces With

Speeds up to 1600 MHz

– EMIF16 Interface

– USB 3.0

– Two UART Interfaces

– Three I2C Interfaces

– 32 GPIO Pins

– Three SPI Interfaces

– Semaphore Module

– 64-Bit Timers

– Twenty 64-Bit Timers for 66AK2H14 and

66AK2H12

– Fourteen 64-Bit Timers for 66AK2H06

– Five On-Chip PLLs

• Commercial Case Temperature:

– 0ºC to 85ºC

• Extended Case Temperature:

– –40ºC to 100ºC

1.2 Applications

• Mission Critical

• Computing

• Communications

• Audio

• Video Infrastructure.

• Imaging

• Analytics

• Networking

• Media Processing

1.3 Description

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x

high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to

5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet

switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded

infrastructure applications like cloud computing, media processing, high-performance computing,

transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in the processor without

sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core

and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with

software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point

(FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an

assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for

visibility into source code execution.