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4406价格

参考价格:¥24.0852

型号:4406 品牌:Cooper Bussmann 备注:这里有4406多少钱,2026年最近7天走势,今日出价,今日竞价,4406批发/采购报价,4406行情走势销售排行榜,4406报价。
型号 功能描述 生产厂家 企业 LOGO 操作

丝印代码:4406;Stereo Click and Pop Eliminator with Audio Muting

文件:946.97 Kbytes Page:16 Pages

RENESAS

瑞萨

丝印代码:4406;Stereo Click and Pop Eliminator with Audio Muting

文件:946.97 Kbytes Page:16 Pages

RENESAS

瑞萨

4406

中低压功率MOS系列(30V)

MOS类沟槽型(Trench)和屏蔽栅沟槽(SGT)功率MOSFET产品,具有导通电阻低、开关特性优、可靠性高等特点。产品广泛应用于电池管理系统、负载开关、通信、消费电子等各个领域

FM

4406

Solder Wire Holder Stand - TJ-227

文件:534.75 Kbytes Page:2 Pages

ADAFRUIT

4406

Push Rivet-Arrow

文件:70.97 Kbytes Page:1 Pages

HEYCO

4406

包装:散装 描述:FUSE BLOCK CART 250V 30A CHASSIS 电路保护 保险丝座

ETC

知名厂家

4406

包装:袋 描述:BL.666, GEAR LEVER HANDLES, DURO 盒子,外壳,机架 手柄

ETC

知名厂家

丝印代码:4406A;30V N-Channel Enhancement-Mode MOSFET

文件:403.02 Kbytes Page:3 Pages

HMSEMI

华之美半导体

IDC Header Lugged 14 Way

Description Header, IDC Lugged, 14Way

MULTICOMP

易络盟

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NC contact ■Cable connection Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the target. I

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, 0.38µm Gold (Au) Selective Plating

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, 0.38µm Gold (Au) Selective Plating

MOLEX

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Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, 0.38µm Gold (Au) Selective Plating

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, 0.38µm Gold (Au) Selective Plating

MOLEX

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Inductive Sensor

Features ■M12 × 1 threaded barrel ■Long version ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interac

TURCKTurck, Inc.

图尔克德国图尔克集团公司

30V N-Channel MOSFET

General Description The AO4406A uses advanced trench technology to provide excellent RDS(ON)with low gate charge. This device is suitable for high side switch in SMPS and general purpose applications. Product Summary VDS 30V ID(at VGS=10V) 13A RDS(ON)(at VGS=10V)

AOSMD

万国半导体

PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins

文件:104.01 Kbytes Page:1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement

文件:2.45415 Mbytes Page:164 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.01 Kbytes Page:3 Pages

MOLEX

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3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.02 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

MOLEX

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3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

MOLEX

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3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating

文件:216.02 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.02 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.01 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating

文件:216.03 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.02 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.03 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.07 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

文件:216.03 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating

文件:216.01 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

文件:216.01 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.03 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.03 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

MOLEX

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

MOLEX

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MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

MOLEX

莫仕

4406产品属性

  • 类型

    描述

  • ID@TC=25℃(A):

    None

  • Rds(on)/Typ 10V(mΩ):

    7.4

  • VGS (±V):

    20

  • VTH(V):

    1~2.0

  • Configuration:

    Single-N

  • Rds(on)Typ4.5V (mΩ):

    10.2

更新时间:2026-5-22 15:11:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Intersil
22+
10TDFN
9000
原厂渠道,现货配单
INTERSIL
22+
QFN-16P
8000
原装正品支持实单
ILSIM
NA
8560
一级代理 原装正品假一罚十价格优势长期供货
ILSIM
25+
NA
880000
明嘉莱只做原装正品现货
Intersil
23+
SOP-8
12800
正规渠道,只有原装!
Intersil
25+
SOP-8
12700
买原装认准中赛美
Intersil
23+
10-TDFN3x3
7300
专注配单,只做原装进口现货
RENESAS(瑞萨)/IDT
2447
TDFN-10(3x3)
105000
6000个/圆盘一级代理专营品牌!原装正品,优势现货,
INTERSIL
23+
QFN-16P
7000
INTE
22+
SOP14
20000
公司只做原装 品质保障

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