4406价格

参考价格:¥24.0852

型号:4406 品牌:Cooper Bussmann 备注:这里有4406多少钱,2025年最近7天走势,今日出价,今日竞价,4406批发/采购报价,4406行情走势销售排行榜,4406报价。
型号 功能描述 生产厂家 企业 LOGO 操作
4406

包装:散装 描述:FUSE BLOCK CART 250V 30A CHASSIS 电路保护 保险丝座

ETC

知名厂家

4406

包装:袋 描述:BL.666, GEAR LEVER HANDLES, DURO 盒子,外壳,机架 手柄

ETC

知名厂家

4406

中低压功率MOS系列(30V)

FM

富满

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NC contact ■Cable connection Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the target. I

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Long version ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interac

TURCKTurck, Inc.

图尔克德国图尔克集团公司

30V N-Channel MOSFET

General Description The AO4406A uses advanced trench technology to provide excellent RDS(ON)with low gate charge. This device is suitable for high side switch in SMPS and general purpose applications. Product Summary VDS 30V ID(at VGS=10V) 13A RDS(ON)(at VGS=10V)

AOSMD

万国半导体

PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins

文件:104.01 Kbytes Page:1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement

文件:2.45415 Mbytes Page:164 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.01 Kbytes Page:3 Pages

Molex

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3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.02 Kbytes Page:3 Pages

Molex

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3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

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3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

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3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, Tin (Sn) Plating

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.01 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, Tin (Sn) Plating

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.07 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating

文件:216.01 Kbytes Page:3 Pages

Molex

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3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

文件:216.01 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

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MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

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MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS

文件:368.17 Kbytes Page:2 Pages

Molex

莫仕

4406产品属性

  • 类型

    描述

  • 型号

    4406

  • 功能描述

    熔丝座 Sngl Block Side Term

  • RoHS

  • 制造商

    Littelfuse

  • 电流额定值

    30 A

  • 电压额定值

    1000 VDC

  • 极数

    1

  • 安装风格

    DIN Rail

更新时间:2025-10-29 11:26:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
molex
23+
针座
5864
原装原标原盒 给价就出 全网最低
MOLEX/莫仕
2508+
/
129991
一级代理,原装现货
-
23+
5000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
MOLEX
DIP-4
35560
一级代理 原装正品假一罚十价格优势长期供货
24+
N/A
51000
一级代理-主营优势-实惠价格-不悔选择
MOLEX
23+
NA
2860
原装正品代理渠道价格优势
原装AO
23+
原厂正规渠道
5000
专注配单,只做原装进口现货
MOLEX
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
44068-0107
25+
353
353
MOLEX
23+
SMD
880000
明嘉莱只做原装正品现货

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