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4406价格
参考价格:¥24.0852
型号:4406 品牌:Cooper Bussmann 备注:这里有4406多少钱,2025年最近7天走势,今日出价,今日竞价,4406批发/采购报价,4406行情走势销售排行榜,4406报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
4406 | 包装:散装 描述:FUSE BLOCK CART 250V 30A CHASSIS 电路保护 保险丝座 | ETC 知名厂家 | ETC | |
4406 | 包装:袋 描述:BL.666, GEAR LEVER HANDLES, DURO 盒子,外壳,机架 手柄 | ETC 知名厂家 | ETC | |
4406 | 中低压功率MOS系列(30V) | ETC 知名厂家 | ETC | |
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NC contact ■Cable connection Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the target. I | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Long version ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interac | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
30V N-Channel MOSFET General Description The AO4406A uses advanced trench technology to provide excellent RDS(ON)with low gate charge. This device is suitable for high side switch in SMPS and general purpose applications. Product Summary VDS 30V ID(at VGS=10V) 13A RDS(ON)(at VGS=10V) | AOSMD 万国半导体 | |||
PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins 文件:104.01 Kbytes Page:1 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | |||
We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement 文件:2.45415 Mbytes Page:164 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.01 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.02 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating 文件:216.02 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.02 Kbytes Page:3 Pages | Molex 莫仕 | |||
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, 0.38µm Gold (Au) Selective Plating | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, Tin (Sn) Plating | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.01 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating 文件:216.03 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.02 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.03 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.07 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating 文件:216.03 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating 文件:216.01 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating 文件:216.01 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.03 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.03 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | Molex 莫仕 |
4406产品属性
- 类型
描述
- 型号
4406
- 功能描述
熔丝座 Sngl Block Side Term
- RoHS
否
- 制造商
Littelfuse
- 电流额定值
30 A
- 电压额定值
1000 VDC
- 极数
1
- 安装风格
DIN Rail
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
台产 |
24+ |
SMD |
5700 |
全新原装数量均有多电话咨询 |
|||
MOLEX |
24+/25+ |
293 |
原装正品现货库存价优 |
||||
MOLEX |
DIP-4 |
35560 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
44068-0107 |
25+ |
353 |
353 |
||||
MOLEXCONNECT |
23+ |
NA |
12550 |
振宏微原装正品,假一罚百 |
|||
MOLEX |
23+ |
SMD |
880000 |
明嘉莱只做原装正品现货 |
|||
MOLEX/莫仕 |
26+ |
NA |
360000 |
只有原装 |
|||
MOLEX/莫仕 |
2508+ |
/ |
129991 |
一级代理,原装现货 |
|||
MOLEX/莫仕 |
2450+ |
NEWINORIGINAL |
6540 |
只做原厂原装现货或订货假一赔十! |
|||
Molex |
25+ |
31443 |
原厂现货渠道 |
4406芯片相关品牌
4406规格书下载地址
4406参数引脚图相关
- 5814
- 555施密特触发器
- 555多谐振荡器
- 555定时器
- 555电路
- 555
- 54286
- 5386
- 5369
- 51单片机
- 500t
- 5000
- 4921
- 4899
- 485接口
- 47471
- 4735
- 47301
- 4591
- 4536
- 440LD22
- 440LD20
- 440LD15
- 440LD10
- 440L_18
- 440GX
- 440GRX
- 440GR
- 440GP
- 440G-MT
- 440EPX
- 440EP
- 4409M
- 4409L
- 4409GM
- 4409GEM
- 4408M
- 4407A
- 4406A
- 44068-0278
- 44068-0099
- 44068-0094
- 44068-0090
- 44068-0089
- 44068-0061
- 44068-0056
- 44068-0046
- 44068-0045
- 44068-0035
- 44068-0022
- 44068-0017
- 440680006
- 44068-0004
- 44068-0001
- 44067-1401
- 44067-0802
- 44067-0201
- 4406-60SR
- 4406-30SR
- 44060
- 4405H
- 44059
- 44058
- 44057
- 44056
- 440557
- 44055
- 44054
- 44053
- 44052
- 44051
- 44050-0007
- 44050-0006
- 44050-0003
- 44050-0002
- 44050-0001
- 44050
- 4405
- 4-404N
- 4404H
- 4404B
- 4404AB51K01700
- 44049
- 440481-000
- 440-47N
- 440-45N
- 44045
- 44044
- 44043
- 44042
- 44041
- 44040
- 44-03A0
- 44-03A
- 44037RC
- 44036RC
- 44034RC
- 440347
4406数据表相关新闻
450BXW120MEFR18X35
进口代理
2025-8-134401-515-000-21
BE MOTORIZED 2X-8X; FUSED SILICA
2024-3-74401-257-000-20
BE MANUAL 2X-8X; WL=532NM
2024-3-74377085 深圳市赛奥斯科技有限公司
4377085 深圳市赛奥斯科技有限公司
2020-6-1844423234
EPIC?MH系列工业连接器 LAPP的EPIC MH系列连接器易于组装,并与市场标准连接器兼容
2020-3-16443250FX
EPIC? 引脚和套管连接器 LAPP 的连接器可保护免受灰尘、湿气和水等环境影响
2020-3-6
DdatasheetPDF页码索引
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