4406价格
参考价格:¥24.0852
型号:4406 品牌:Cooper Bussmann 备注:这里有4406多少钱,2026年最近7天走势,今日出价,今日竞价,4406批发/采购报价,4406行情走势销售排行榜,4406报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
丝印代码:4406;Stereo Click and Pop Eliminator with Audio Muting 文件:946.97 Kbytes Page:16 Pages | RENESAS 瑞萨 | |||
丝印代码:4406;Stereo Click and Pop Eliminator with Audio Muting 文件:946.97 Kbytes Page:16 Pages | RENESAS 瑞萨 | |||
4406 | 中低压功率MOS系列(30V) MOS类沟槽型(Trench)和屏蔽栅沟槽(SGT)功率MOSFET产品,具有导通电阻低、开关特性优、可靠性高等特点。产品广泛应用于电池管理系统、负载开关、通信、消费电子等各个领域 | FM | ||
4406 | Solder Wire Holder Stand - TJ-227 文件:534.75 Kbytes Page:2 Pages | ADAFRUIT | ||
4406 | Push Rivet-Arrow 文件:70.97 Kbytes Page:1 Pages | HEYCO | ||
4406 | 包装:散装 描述:FUSE BLOCK CART 250V 30A CHASSIS 电路保护 保险丝座 | ETC 知名厂家 | ETC | |
4406 | 包装:袋 描述:BL.666, GEAR LEVER HANDLES, DURO 盒子,外壳,机架 手柄 | ETC 知名厂家 | ETC | |
丝印代码:4406A;30V N-Channel Enhancement-Mode MOSFET 文件:403.02 Kbytes Page:3 Pages | HMSEMI 华之美半导体 | |||
IDC Header Lugged 14 Way Description Header, IDC Lugged, 14Way | MULTICOMP 易络盟 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NC contact ■Cable connection Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the target. I | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, 0.38µm Gold (Au) Selective Plating Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, 0.38µm Gold (Au) Selective Plating | MOLEX 莫仕 | |||
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, 0.38µm Gold (Au) Selective Plating Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 8 Circuits, 0.38µm Gold (Au) Selective Plating | MOLEX 莫仕 | |||
Inductive Sensor Features ■M12 × 1 threaded barrel ■Long version ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interac | TURCKTurck, Inc. 图尔克德国图尔克集团公司 | |||
30V N-Channel MOSFET General Description The AO4406A uses advanced trench technology to provide excellent RDS(ON)with low gate charge. This device is suitable for high side switch in SMPS and general purpose applications. Product Summary VDS 30V ID(at VGS=10V) 13A RDS(ON)(at VGS=10V) | AOSMD 万国半导体 | |||
PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins 文件:104.01 Kbytes Page:1 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | |||
We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement 文件:2.45415 Mbytes Page:164 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.01 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.02 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating 文件:216.02 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.02 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.01 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating 文件:216.03 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.02 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.03 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.07 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating 文件:216.03 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating 文件:216.01 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating 文件:216.01 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 文件:216.03 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 文件:216.03 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 文件:216.08 Kbytes Page:3 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 | |||
MINI-FIT JR BMI SMC VERTICAL HEADER ASM VARIOUS BOARD THICKNESS 文件:368.17 Kbytes Page:2 Pages | MOLEX 莫仕 |
4406产品属性
- 类型
描述
- ID@TC=25℃(A):
None
- Rds(on)/Typ 10V(mΩ):
7.4
- VGS (±V):
20
- VTH(V):
1~2.0
- Configuration:
Single-N
- Rds(on)Typ4.5V (mΩ):
10.2
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Intersil |
22+ |
10TDFN |
9000 |
原厂渠道,现货配单 |
|||
INTERSIL |
22+ |
QFN-16P |
8000 |
原装正品支持实单 |
|||
ILSIM |
NA |
8560 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
ILSIM |
25+ |
NA |
880000 |
明嘉莱只做原装正品现货 |
|||
Intersil |
23+ |
SOP-8 |
12800 |
正规渠道,只有原装! |
|||
Intersil |
25+ |
SOP-8 |
12700 |
买原装认准中赛美 |
|||
Intersil |
23+ |
10-TDFN3x3 |
7300 |
专注配单,只做原装进口现货 |
|||
RENESAS(瑞萨)/IDT |
2447 |
TDFN-10(3x3) |
105000 |
6000个/圆盘一级代理专营品牌!原装正品,优势现货, |
|||
INTERSIL |
23+ |
QFN-16P |
7000 |
||||
INTE |
22+ |
SOP14 |
20000 |
公司只做原装 品质保障 |
4406规格书下载地址
4406参数引脚图相关
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- 555定时器
- 555电路
- 555
- 54286
- 5386
- 5369
- 51单片机
- 500t
- 5000
- 4921
- 4899
- 485接口
- 47471
- 4735
- 47301
- 4591
- 4536
- 440LD22
- 440LD20
- 440LD15
- 440LD10
- 440L_18
- 440GX
- 440GRX
- 440GR
- 440GP
- 440G-MT
- 440EPX
- 440EP
- 4409M
- 4409L
- 4409GM
- 4409GEM
- 4408M
- 4407A
- 4406A
- 44068-0278
- 44068-0099
- 44068-0094
- 44068-0090
- 44068-0089
- 44068-0061
- 44068-0056
- 44068-0046
- 44068-0045
- 44068-0035
- 44068-0022
- 44068-0017
- 440680006
- 44068-0004
- 44068-0001
- 44067-1401
- 44067-0802
- 44067-0201
- 4406-60SR
- 4406-30SR
- 44060
- 4405H
- 44059
- 44058
- 44057
- 44056
- 440557
- 44055
- 44054
- 44053
- 44052
- 44051
- 44050-0007
- 44050-0006
- 44050-0003
- 44050-0002
- 44050-0001
- 44050
- 4405
- 4-404N
- 4404H
- 4404B
- 4404AB51K01700
- 44049
- 440481-000
- 440-47N
- 440-45N
- 44045
- 44044
- 44043
- 44042
- 44041
- 44040
- 44-03A0
- 44-03A
- 44037RC
- 44036RC
- 44034RC
- 440347
4406数据表相关新闻
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2025-8-134401-515-000-21
BE MOTORIZED 2X-8X; FUSED SILICA
2024-3-74401-257-000-20
BE MANUAL 2X-8X; WL=532NM
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4377085 深圳市赛奥斯科技有限公司
2020-6-1844423234
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DdatasheetPDF页码索引
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