44067价格

参考价格:¥1.7825

型号:44067-0201 品牌:Molex 备注:这里有44067多少钱,2025年最近7天走势,今日出价,今日竞价,44067批发/采购报价,44067行情走势销售排行榜,44067报价。
型号 功能描述 生产厂家 企业 LOGO 操作
44067

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interacts with the tar

TURCKTurck, Inc.

图尔克德国图尔克集团公司

Inductive Sensor

Features ■M12 × 1 threaded barrel ■Long version ■Chrome-plated brass ■DC 2-wire, 10…65 VDC ■NO contact ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects contactless and wear-free. For this, they use a high-frequency electromagnetic AC field that interac

TURCKTurck, Inc.

图尔克德国图尔克集团公司

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.01 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 10 Circuits, Tin (Sn) Plating

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.01 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, Tin (Sn) Plating

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.02 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.07 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 18 Circuits, 0.76µm Gold (Au) Selective Plating

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating

文件:216.01 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

文件:216.01 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

文件:216.03 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

文件:216.08 Kbytes Page:3 Pages

Molex

莫仕

Driver IC for stepping motor

Low Ron, Various Current Ranges Panasonic, a worldwide leader in Semiconductor Products, is pleased to announce these NEW Stepper Motor Driver Series to their already existing product line. This broadened selection of IC’s for Stepper Motor Drivers offer built-in functionality in smaller case

Panasonic

松下

Driver IC for Stepping Motor

Low Ron, Various Current Ranges Panasonic, a worldwide leader in Semiconductor Products, is pleased to announce these NEW Stepper Motor Driver Series to their already existing product line. This broadened selection of IC’s for Stepper Motor Drivers offer built-in functionality in smaller case

Panasonic

松下

Stepper Motor Driver IC?셲 From Panasonic

文件:387.06 Kbytes Page:1 Pages

Panasonic

松下

44067产品属性

  • 类型

    描述

  • 型号

    44067

  • 功能描述

    集管和线壳 Microfit Vert Hdr TH DR Tin 2Ckt

  • RoHS

  • 产品种类

    1.0MM Rectangular Connectors

  • 产品类型

    Headers - Pin Strip

  • 系列

    DF50

  • 触点类型

    Pin(Male)

  • 节距

    1 mm

  • 位置/触点数量

    16

  • 排数

    1

  • 安装风格

    SMD/SMT

  • 安装角

    Right

  • 端接类型

    Solder

  • 外壳材料

    Liquid Crystal Polymer(LCP)

  • 触点材料

    Brass

  • 触点电镀

    Gold

  • 制造商

    Hirose Connector

更新时间:2025-10-29 17:10:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MOLEX
2450+
SOP
6540
只做原厂原装正品终端客户免费申请样品
MOLEX/莫仕
2508+
/
484664
一级代理,原装现货
MOLEX/莫仕
24+
39997
原厂现货渠道
TYCO/AMP
23+
4800
原厂授权代理,海外优势订货渠道。可提供大量库存,详
24+
N/A
72000
一级代理-主营优势-实惠价格-不悔选择
MOLEX
24+
con
35960
查现货到京北通宇商城
Molex
24+
con
2500
CJT品牌降本替代型号C3030WV-2x8P-LCP-G30-D40
MOLEX INC
24+
SMD
8600
正品原装,正规渠道,免费送样。支持账期,BOM一站式配齐

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