Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

Memory Card IC 64/32 Kbit Serial I짼C Bus EEPROM

DESCRIPTION Each device is an electrically erasable programmable memory (EEPROM) fabricated with STMicroelectronics’s High Endurance, Single Polysilicon, CMOS technology. This guarantees an endurance typically well above one million Erase/Write cycles, with a data retention of 40 years. The memor

M14C32 Die Description

PRODUCT M14C32 ■ WAFER SIZE 152 mm (6 inches) ■ DIE IDENTIFICATION M14C32KA_R ■ DIE SIZE (X x Y) 2040 x 2355 µm ■ SCRIBE LINE 100.5 x 101.7 µm ■ PAD OPENING 100 x 100 µm