SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS

DESCRIPTION µPC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP. Quadrature modulator IC (µPC8101GR) is also available as

SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS

DESCRIPTION µPC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP. Quadrature modulator IC (µPC8101GR) is also available as

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Operating frequency – fRF = 800 MHz to 900 MHz, fIF = 50 MHz to 150 MHz, fLo = 650 MHz to 1 050 MHz • Upconverter and downconverter are integrated in 1 chip. • 20 pin SSOP suitable for high-density surface mounting. • Wide operating voltage VCC = 2.7 to 4.5 V • Equipped with Power

SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS

DESCRIPTION µPC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP. Quadrature modulator IC (µPC8101GR) is also available as

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Operating frequency – fRF = 800 MHz to 900 MHz, fIF = 50 MHz to 150 MHz, fLo = 650 MHz to 1 050 MHz • Upconverter and downconverter are integrated in 1 chip. • 20 pin SSOP suitable for high-density surface mounting. • Wide operating voltage VCC = 2.7 to 4.5 V • Equipped with Power

150 MHz SILICON QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATIONS

DESCRIPTION The UPC8101GR is a Silicon Monolithic Integrated Circuit (MMIC) which is manufactured using NECs 20 GHz fT NESAT III process. The Quadrature Modulator was designed for digital mobile communications in general, and the CT2 band requirements in particular. Operating on DC bias voltages

1 GHz DIRECT QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8110GR is a sillicon monolithic integrated circuit designed as 1 GHz direct quadrature modulator for digital mobile communication systems. This modulator housed in a 20 pin plastic SSOP that easy to install and contributes to miniaturizing the system. The device has power save

400 MHz QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8105GR is a sillicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator housed in a 16 pin plastic SSOP that is easy to install and contributes to miniaturizing the system. The device has power save function

UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The UPC8125GR is a Silicon MMIC manufactured with the NESAT IIITM silicon bipolar process. The IC consists of a 1.8 - 2.0 GHz upconverter with AGC function and a 220 - 270 MHz IQ modulator. The device operates over a wide 2.7 - 5.5 V supply voltage range and features a power save func

900 MHz BAND DIRECT QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8126K is a silicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This IC integrates a pre-mixer for local signals plus a quadrature modulator operating from 889 MHz to 960 MHz. The chip which has been conventionally pac

Single Chip Transceiver Silicon MMIC for PHS

DESCRIPTION The µPC8139GR-7JH is a silicon microwave monolithic IC (SiMMIC) developed as a transceiver for Personal Handyphone System (PHS). This IC is a highly integrated single chip, suitable for PHS, including a quadrature modulator, up converter, and AGC circuit for adjusting the output leve

UP CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8129GR is a silicon monolithic integrated circuit designed as indirect quadrature modulator for digital mobile communication systems. This modulator consists of 0.8 GHz to 1.9 GHz up-converter and 100 MHz to 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The de

150 MHz SILICON QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATIONS

DESCRIPTION The UPC8101GR is a Silicon Monolithic Integrated Circuit (MMIC) which is manufactured using NECs 20 GHz fT NESAT III process. The Quadrature Modulator was designed for digital mobile communications in general, and the CT2 band requirements in particular. Operating on DC bias voltages

RF UP-CONVERTER WITH AGC FUNCTION IF QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8158K is a silicon microwave monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This MMIC consists of 0.8 GHz to 1.5 GHz up-converter and 100 MHz to 300 MHz quadrature modulator which are equipped with AGC and power save fun

1 GHz DIRECT QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8110GR is a sillicon monolithic integrated circuit designed as 1 GHz direct quadrature modulator for digital mobile communication systems. This modulator housed in a 20 pin plastic SSOP that easy to install and contributes to miniaturizing the system. The device has power save

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Operating frequency: fIF = 50 MHz to 150 MHz, Local input frequency: fLo = 100 MHz to 300 MHz, fI/Q = DC to 500 kHz • Digital 90° phase shifter is incorporated. (Due to the flip flop phase shifter, fIF = fLo/2 + fI/Q.) • 20 pin SSOP suitable for high-density surface mounting. • Supp

150 MHz SILICON QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATIONS

DESCRIPTION The UPC8101GR is a Silicon Monolithic Integrated Circuit (MMIC) which is manufactured using NECs 20 GHz fT NESAT III process. The Quadrature Modulator was designed for digital mobile communications in general, and the CT2 band requirements in particular. Operating on DC bias voltages

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Operating frequency: fIF = 50 MHz to 150 MHz, Local input frequency: fLo = 100 MHz to 300 MHz, fI/Q = DC to 500 kHz • Digital 90° phase shifter is incorporated. (Due to the flip flop phase shifter, fIF = fLo/2 + fI/Q.) • 20 pin SSOP suitable for high-density surface mounting. • Supp

RF AMPLIFIER IC FOR 150 MHz TO 330 MHz PAGER SYSTEM

DESCRIPTION µPC8102T is a silicon monolisic integrated circuit designed as RF amplifier for 150 MHz to 330 MHz pager system. Due to 1 V supply voltage, this IC is suitable for low voltage pager system. The package is a 6 pin mini mold suitable for high-density surface mounting. This IC is manufa

RF AMPLIFIER IC FOR 150 MHz TO 330 MHz PAGER SYSTEM

DESCRIPTION µPC8102T is a silicon monolisic integrated circuit designed as RF amplifier for 150 MHz to 330 MHz pager system. Due to 1 V supply voltage, this IC is suitable for low voltage pager system. The package is a 6 pin mini mold suitable for high-density surface mounting. This IC is manufa

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • 1 V supply voltage: VCC = 0.9 V to 2.0 V • Low noise figure: 2.3 dBTYP. @ fin = 150 MHz (with external matching circuit to optimize NF) • Low current consumption: ICC = 0.5 mATYP. @ VCC = 1.0 V • Gain available frequency: fRF = 150 MHz to 330 MHz (with external matching circuit) •

RF AMPLIFIER IC FOR 150 MHz TO 330 MHz PAGER SYSTEM

DESCRIPTION µPC8102T is a silicon monolisic integrated circuit designed as RF amplifier for 150 MHz to 330 MHz pager system. Due to 1 V supply voltage, this IC is suitable for low voltage pager system. The package is a 6 pin mini mold suitable for high-density surface mounting. This IC is manufa

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • 1 V supply voltage: VCC = 0.9 V to 2.0 V • Low noise figure: 2.3 dBTYP. @ fin = 150 MHz (with external matching circuit to optimize NF) • Low current consumption: ICC = 0.5 mATYP. @ VCC = 1.0 V • Gain available frequency: fRF = 150 MHz to 330 MHz (with external matching circuit) •

MIXER OSCILLATOR IC FOR PAGER SYSTEM

DESCRIPTION µPC8103T and µPC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting.

MIXER OSCILLATOR IC FOR PAGER SYSTEM

DESCRIPTION µPC8103T and µPC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting.

MIXER OSCILLATOR IC FOR PAGER SYSTEM

DESCRIPTION µPC8103T and µPC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting.

UP CONVERTER QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8104GR is a silicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator consists of 1.9 GHz up-converter and 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The device has power save function

UP CONVERTER QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8104GR is a silicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator consists of 1.9 GHz up-converter and 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The device has power save function

400 MHz QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8105GR is a sillicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator housed in a 16 pin plastic SSOP that is easy to install and contributes to miniaturizing the system. The device has power save function

900 MHz BAND DIRECT QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8126K is a silicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This IC integrates a pre-mixer for local signals plus a quadrature modulator operating from 889 MHz to 960 MHz. The chip which has been conventionally pac

UP CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8129GR is a silicon monolithic integrated circuit designed as indirect quadrature modulator for digital mobile communication systems. This modulator consists of 0.8 GHz to 1.9 GHz up-converter and 100 MHz to 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The de

Single Chip Transceiver Silicon MMIC for PHS

DESCRIPTION The µPC8139GR-7JH is a silicon microwave monolithic IC (SiMMIC) developed as a transceiver for Personal Handyphone System (PHS). This IC is a highly integrated single chip, suitable for PHS, including a quadrature modulator, up converter, and AGC circuit for adjusting the output leve

RF UP-CONVERTER WITH AGC FUNCTION IF QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8158K is a silicon microwave monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This MMIC consists of 0.8 GHz to 1.5 GHz up-converter and 100 MHz to 300 MHz quadrature modulator which are equipped with AGC and power save fun

1 GHz DIRECT QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8110GR is a sillicon monolithic integrated circuit designed as 1 GHz direct quadrature modulator for digital mobile communication systems. This modulator housed in a 20 pin plastic SSOP that easy to install and contributes to miniaturizing the system. The device has power save

UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The UPC8125GR is a Silicon MMIC manufactured with the NESAT IIITM silicon bipolar process. The IC consists of a 1.8 - 2.0 GHz upconverter with AGC function and a 220 - 270 MHz IQ modulator. The device operates over a wide 2.7 - 5.5 V supply voltage range and features a power save func

UP CONVERTER QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8104GR is a silicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator consists of 1.9 GHz up-converter and 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The device has power save function

400 MHz QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8105GR is a sillicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator housed in a 16 pin plastic SSOP that is easy to install and contributes to miniaturizing the system. The device has power save function

UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The UPC8125GR is a Silicon MMIC manufactured with the NESAT IIITM silicon bipolar process. The IC consists of a 1.8 - 2.0 GHz upconverter with AGC function and a 220 - 270 MHz IQ modulator. The device operates over a wide 2.7 - 5.5 V supply voltage range and features a power save func

UP CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8129GR is a silicon monolithic integrated circuit designed as indirect quadrature modulator for digital mobile communication systems. This modulator consists of 0.8 GHz to 1.9 GHz up-converter and 100 MHz to 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The de

Single Chip Transceiver Silicon MMIC for PHS

DESCRIPTION The µPC8139GR-7JH is a silicon microwave monolithic IC (SiMMIC) developed as a transceiver for Personal Handyphone System (PHS). This IC is a highly integrated single chip, suitable for PHS, including a quadrature modulator, up converter, and AGC circuit for adjusting the output leve

1 GHz DIRECT QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8110GR is a sillicon monolithic integrated circuit designed as 1 GHz direct quadrature modulator for digital mobile communication systems. This modulator housed in a 20 pin plastic SSOP that easy to install and contributes to miniaturizing the system. The device has power save

900 MHz BAND DIRECT QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8126K is a silicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This IC integrates a pre-mixer for local signals plus a quadrature modulator operating from 889 MHz to 960 MHz. The chip which has been conventionally pac

RF UP-CONVERTER WITH AGC FUNCTION IF QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION The µPC8158K is a silicon microwave monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This MMIC consists of 0.8 GHz to 1.5 GHz up-converter and 100 MHz to 300 MHz quadrature modulator which are equipped with AGC and power save fun

400 MHz QUADRATURE MODULATOR FOR DIGITAL MOBILE COMMUNICATION

DESCRIPTION The µPC8105GR is a sillicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator housed in a 16 pin plastic SSOP that is easy to install and contributes to miniaturizing the system. The device has power save function

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

DESCRIPTION The UPC8106T and UPC8109T are L-Band Frequency UpConverters manufactured using the NESAT III MMIC process. The UPC8106T was designed for low distortion while the UPC8109T was designed for low current consumption. Operation from a 3 volt supply voltage makes this device ideal for handh

SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conv

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR TELEPHONE

DESCRIPTION The µPC8163TB is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone transmitter stage. The µPC8163TB has improved intermodulation performance and smaller package. The µPC8163TB is manufactured using NEC’s 20 GHz fT NESATTMlll silicon bip

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES • Recommended operating frequency : fRFout = 0.4 to 2.0 GHz, fIFin = 100 to 400 MHz • Supply voltage : VCC = 2.7 to 5.5 V • High-density surface mounting : 6-pin super minimold package • Low current consumption : ICC = 9 mA TYP. @ mPC8106TB ICC = 5 mA TYP. @ mPC8109TB • Minimized ca

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • High output frequency : fRFout = 0.8 to 2.5 GHz • High-density surface mounting : 6-pin super minimold package • Supply voltage : VCC = 2.7 to 3.3 V • Higher IP3 : OIP3 = +10 dBm @ fRFout = 1.9 GHz

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES • Recommended operating frequency : fRFout = 0.4 to 2.0 GHz, fIFin = 100 to 400 MHz • Supply voltage : VCC = 2.7 to 5.5 V • High-density surface mounting : 6-pin super minimold package • Low current consumption : ICC = 9 mA TYP. @ mPC8106TB ICC = 5 mA TYP. @ mPC8109TB • Minimized ca

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

DESCRIPTION The UPC8106T and UPC8109T are L-Band Frequency UpConverters manufactured using the NESAT III MMIC process. The UPC8106T was designed for low distortion while the UPC8109T was designed for low current consumption. Operation from a 3 volt supply voltage makes this device ideal for handh

MIXER OSCILLATOR IC FOR PAGER SYSTEM

DESCRIPTION µPC8103T and µPC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting.

MIXER OSCILLATOR IC FOR PAGER SYSTEM

DESCRIPTION µPC8103T and µPC8108T are silicon monolithic integrated circuits designed as mixer-oscillator series for pager system. Due to 1 V supply voltage, these ICs are suitable for low voltage pager system. These ICs are packaged in 6 pin mini mold suitable for high-density surface mounting.

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

DESCRIPTION The UPC8106T and UPC8109T are L-Band Frequency UpConverters manufactured using the NESAT III MMIC process. The UPC8106T was designed for low distortion while the UPC8109T was designed for low current consumption. Operation from a 3 volt supply voltage makes this device ideal for handh

SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conv

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR TELEPHONE

DESCRIPTION The µPC8163TB is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone transmitter stage. The µPC8163TB has improved intermodulation performance and smaller package. The µPC8163TB is manufactured using NEC’s 20 GHz fT NESATTMlll silicon bip

Integrated Circuit Audio Power Amplifier, 1W

5.8W AUDIO POWER AMP