SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

DESCRIPTION The UPC8106T and UPC8109T are L-Band Frequency UpConverters manufactured using the NESAT III MMIC process. The UPC8106T was designed for low distortion while the UPC8109T was designed for low current consumption. Operation from a 3 volt supply voltage makes this device ideal for handh

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conv

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR TELEPHONE

DESCRIPTION The µPC8163TB is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone transmitter stage. The µPC8163TB has improved intermodulation performance and smaller package. The µPC8163TB is manufactured using NEC’s 20 GHz fT NESATTMlll silicon bip

BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES • Recommended operating frequency : fRFout = 0.4 to 2.0 GHz, fIFin = 100 to 400 MHz • Supply voltage : VCC = 2.7 to 5.5 V • High-density surface mounting : 6-pin super minimold package • Low current consumption : ICC = 9 mA TYP. @ mPC8106TB ICC = 5 mA TYP. @ mPC8109TB • Minimized ca

BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • High output frequency : fRFout = 0.8 to 2.5 GHz • High-density surface mounting : 6-pin super minimold package • Supply voltage : VCC = 2.7 to 3.3 V • Higher IP3 : OIP3 = +10 dBm @ fRFout = 1.9 GHz

BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES • Recommended operating frequency : fRFout = 0.4 to 2.0 GHz, fIFin = 100 to 400 MHz • Supply voltage : VCC = 2.7 to 5.5 V • High-density surface mounting : 6-pin super minimold package • Low current consumption : ICC = 9 mA TYP. @ mPC8106TB ICC = 5 mA TYP. @ mPC8109TB • Minimized ca

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

DESCRIPTION The UPC8106T and UPC8109T are L-Band Frequency UpConverters manufactured using the NESAT III MMIC process. The UPC8106T was designed for low distortion while the UPC8109T was designed for low current consumption. Operation from a 3 volt supply voltage makes this device ideal for handh

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

文件：46.77 Kbytes Page：5 Pages

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

文件：46.77 Kbytes Page：5 Pages

SILICON RFIC HI-IP3 FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

文件：121.05 Kbytes Page：8 Pages

3 V SILICON RFIC FREQUENCY UPCONVERTER

文件：224.82 Kbytes Page：10 Pages

3 V SILICON RFIC FREQUENCY UPCONVERTER

文件：224.82 Kbytes Page：10 Pages

封装/外壳：6-TSSOP，SC-88，SOT-363 包装：散装 描述：IC MIXER 400MHZ-2.5GHZ UP 6SMINI RF/IF，射频/中频和 RFID 射频混频器

包装：盒 描述：EVAL BOARD FOR UPC8106 900MHZ 开发板，套件，编程器 射频评估和开发套件，开发板

3 V, SILICON MMIC FREQUENCY UP-CONVERTER

文件：46.77 Kbytes Page：5 Pages

RS232/422 Low Cap, #24-6pr, FPO, O/A FoilBraid, PVC Jkt, CM, 100Ω

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

Tsunami Detection System

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MARC REMOVABLE PIN SOCKET CONTACTS

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Low Capacitance for EIA RS-232 and EIA RS-422 Applications

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Common Mode Inductors (with Optional Header) Dielectric strength: 1500 Vrms

文件：103.77 Kbytes Page：1 Pages