型号 功能描述 生产厂家&企业 LOGO 操作

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

封装/外壳:64-TBGA 包装:管件 描述:IC FLASH 16MBIT PAR 64EASYBGA 集成电路(IC) 存储器

ELPIDAElpida Memory

美光科技美光科技股份有限公司

ELPIDA

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation

英特尔

Intel

3VoltIntelAdvancedBootBlockFlashMemory

DeviceDescription ThissectionprovidesanoverviewoftheIntel®Advanced+BootBlockFlashMemory(C3)devicefeatures,packaging,signalnaming,anddevicearchitecture. ProductOverview TheC3deviceprovideshigh-performanceasynchronousreadsinpackage-compatibledensitieswitha16bit

IntelIntel Corporation

英特尔

Intel

FLASHMEMORY

GENERALDESCRIPTION TheMT28F160C3isanonvolatile,electricallyblockerasable(flash),programmable,read-onlymemorycontaining16,777,216bitsorganizedas1,048,576words(16bits). TheMT28F160C3ismanufacturedon0.22µmprocesstechnologyina48-ballFBGApackage.ThedevicehasanI/O

MicronMicron Technology

镁光美国镁光科技有限公司

Micron

16M-BIT[1Mx16]CMOSSINGLEVOLTAGE3VONLYFLASHMEMORY

文件:417.03 Kbytes Page:44 Pages

MCNIXMacronix International

????????????旺宏????????????旺宏电子

MCNIX

16M-BIT[1Mx16]CMOSSINGLEVOLTAGE3VONLYFLASHMEMORY

文件:417.03 Kbytes Page:44 Pages

MCNIXMacronix International

????????????旺宏????????????旺宏电子

MCNIX

RC28F160C3B产品属性

  • 类型

    描述

  • 型号

    RC28F160C3B

  • 功能描述

    IC FLASH 16MBIT 110NS 64BGA

  • RoHS

  • 类别

    集成电路(IC) >> 存储器

  • 系列

    -

  • 标准包装

    150

  • 系列

    - 格式 -

  • 存储器

    EEPROMs - 串行

  • 存储器类型

    EEPROM

  • 存储容量

    4K(2 x 256 x 8)

  • 速度

    400kHz

  • 接口

    I²C,2 线串口

  • 电源电压

    2.5 V ~ 5.5 V

  • 工作温度

    -40°C ~ 85°C

  • 封装/外壳

    8-VFDFN 裸露焊盘

  • 供应商设备封装

    8-DFN(2x3)

  • 包装

    管件

  • 产品目录页面

    1445(CN2011-ZH PDF)

更新时间:2025-7-4 8:31:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
INTEL
17+
BGA
6200
100%原装正品现货
INTEL
23+
BGA
541
原装正品现货
INTEL
2020+
BGA
14960
百分百原装正品 真实公司现货库存 本公司只做原装 可
INTEL/英特尔
24+
BGA64
45310
只做全新原装进口现货
Micron Technology Inc.
21+
208-LFBGA
5280
进口原装!长期供应!绝对优势价格(诚信经营
INTEL/英特尔
24+
NA/
3442
原厂直销,现货供应,账期支持!
INTEL(英特尔)
24+
标准封装
12048
原厂渠道供应,大量现货,原型号开票。
SONY
23+
CCD镜片
12000
全新原装假一赔十
INTEL
24+
BGA64
80000
只做自己库存,全新原装进口正品假一赔百,可开13%增
INTEL
0937+
BGA64
225
一级代理,专注军工、汽车、医疗、工业、新能源、电力

RC28F160C3B芯片相关品牌

  • AMPHENOLCS
  • Central
  • GENESIC
  • Intersil
  • IRCTT
  • KSS
  • Marktech
  • PROTEC
  • PTC
  • SOURCE
  • TAIYO-YUDEN
  • WEITRON

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