SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cuwireinterconnectforlowcost StandardJEDECpackageoutlines Multi-dieproductioncapability Turnkeytestservices,includingstriptestoptions Greenmaterialsarestandard–Pb-freeandRoHScompliant Stealthdicing(narrowsawstreets) Larger/Higherdensityleadframe

Shrink Small Outline, Quarter-Size Small-Outline Packages

文件：433.21 Kbytes Page：2 Pages

RoHS compliant and Sn/Pb terminations available

文件：442.95 Kbytes Page：4 Pages

QSOP Thin Film on Ceramic Resistor Networks

Features: •Precisionratiotolerancesto±0.05% •TrackingTCRto±5ppm/°C •Reliable,nointernalcavity •StandardJEDEC16,20&24pinpackages •Ultra-stableTaNresistorsonceramicsubstrate •Lowercrosstalkthansiliconsubstratetypes

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Package MQA24

文件：78.96 Kbytes Page：1 Pages