SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Stealth dicing (narrow saw streets) Larger/Higher density leadframe

RoHS compliant and Sn/Pb terminations available

文件：442.95 Kbytes Page：4 Pages

RoHS compliant and Sn/Pb terminations available

Shrink Small Outline, Quarter-Size Small-Outline Packages

文件：433.21 Kbytes Page：2 Pages

QSOP Thin Film on Ceramic Resistor Networks

Features: • Precision ratio tolerances to ±0.05% • Tracking TCR to ±5ppm/°C • Reliable, no internal cavity • Standard JEDEC 16, 20 & 24 pin packages • Ultra-stable TaN resistors on ceramic substrate • Lower crosstalk than silicon substrate types

SUGGESTED PAD LAYOUT

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes Page：27 Pages

Package MQA24

文件：78.96 Kbytes Page：1 Pages