LOW POWER FPGA COMBINING PERFORMANCE DENSITY AND EMBEDED RAM

[QuickLogic] Device Highlight Flexible Programmable Logic • 0.18 µ, six layer metal CMOS process • 1.8 V Vcc, 1.8/2.5/3.3 V drive capable I/O • Up to 4,008 dedicated flip-flops • Up to 55.3 K embedded RAM Bits • Up to 313 I/O • Up to 370 K system gates • IEEE 1149.1 Boundary Scan Testing

6-Pin DIP Optoisolators Darlington Ouput(No Base Connection)

The MOC8030 and MOC8050 devices consist of gallium arsenide infrared emitting diodes optically coupled to monolithic silicon photodarlington detectors. The chip to Pin 6 base connection has been eliminated to improve output performance in high noise environments. They are best suited for use in a

TRANSISTOR (NPN)

FEATURES ● Power Dissipation PCM : 1 W (Tamb=25°C) ● Collector Current ICM : 1.5 A ● Collector - Base Voltage V(BR)CBO : 40V

1.5A MOTOR DRIVER WITH BRAKE FUNCTION

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QPSK transmitter

文件：125.43 Kbytes Page：28 Pages

TDA8046H

文件：127.21 Kbytes Page：24 Pages