ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

PCIe Bridges : PEX 8112

The ExpressLane™ PEX 8112 is a high performance bridge designed to the PCI Express-to-PCI Bridge Specification 1.0, that enables designers to migrate legacy PCI bus interfaces to the new advanced serial PCI Express. This 2-port device is equipped with a single lane PCI Express port and a parallel bu

ExpressLane??PCI Express to PCI Bridge

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ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

封装/外壳：144-BGA 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC INTERFACE SPECIALIZED 144BGA 集成电路（IC） 专用

Very fast high-voltage soft-recovery controlled avalanche rectifiers

DESCRIPTION Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. FEATURES

6-Pin DIP Optoisolators Transistor Output(No Base Connection)

6-Pin DIP Optoisolators Transistor Output(No Base Connection) The MOC8111, MOC8112 and MOC8113 devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector. The internal base–to–Pin 6 connection has been eliminated for improved n

Digital camera signal processor and microcontroller

GENERAL DESCRIPTION The SAA8112HL is a powerful and versatile 10-bit digital processor for video cameras. It processes the digitized sensor data and converts it to a high quality, multi-format and YUV digital signal. In addition, the SAA8112HL performs programmable statistical measurements on t

SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE

DESCRIPTION The µPC8112TB is a silicon monolithic integrated circuit designed as 1st frequency down-converter for cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. The µPC8112TB features high impedance output of open collector. Similar ICs of the µPC2757TB

SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE

DESCRIPTION The µPC8112TB is a silicon monolithic integrated circuit designed as 1st frequency down-converter for cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. The µPC8112TB features high impedance output of open collector. Similar ICs of the µPC2757TB