位置:BY8112 > BY8112详情
BY8112中文资料
BY8112数据手册规格书PDF详情
DESCRIPTION
Rugged glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Soft-recovery switching characteristics
• Compact construction.
APPLICATIONS
• For colour television and monitors up to 128 kHz
• High-voltage applications for:
– Multipliers
– Layer-wound diode-splittransformers where controlled avalanche is required.
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
23+ |
原厂正规渠道 |
5000 |
专注配单,只做原装进口现货 |
|||
PHI |
25+ |
SOD |
700 |
原装正品,假一罚十! |
|||
PHI |
23+ |
SOD |
50000 |
全新原装正品现货,支持订货 |
|||
PHI |
24+ |
NA/ |
3950 |
原装现货,当天可交货,原型号开票 |
|||
PHI |
25+ |
SOD |
2987 |
只售原装自家现货!诚信经营!欢迎来电! |
|||
BROADCOM |
24+ |
BGA |
6618 |
公司现货库存,支持实单 |
|||
Bychip/百域芯 |
21+ |
SOT23-6 |
30000 |
实单必成 质强价优 可开13点增值税 |
|||
BYSEMI/博越 |
25+ |
DIP |
35 |
全新原装正品支持含税 |
|||
BY |
2022+ |
SOP28 |
3000 |
原厂代理 终端免费提供样品 |
|||
百为 |
18 |
1 |
优势货源原装正品 |
BY8112 资料下载更多...
BY8112 芯片相关型号
PHILIPS相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
