位置:首页 > IC中文资料第585页 > PAL16R4
型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
---|---|---|---|---|
PAL16R4 | 20-PIN TTL PROGRAMMABLE ARRAY LOGIC GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and | AMD 超威半导体 | ||
PAL16R4 | 20-Pin TTL Programmable Array Logic GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and | AMD 超威半导体 | ||
PAL16R4 | HIGH-PERFORMANCE IMPACT-X E PAL) CIRCUITS High-Performance Operation: fmax (no feedback) TIBPAL16R’ -5C Series . . . 125 MHz Min TIBPAL16R’ -7M Series . . . 100 MHz Min fmax (internal feedback) TIBPAL16R’ -5C Series . . . 125 MHz Min TIBPAL16R’ -7M Series . . . 100 MHz Min fmax (external feedback) TIBPAL16R’ -5C Series . . . 117 M | TI 德州仪器 | ||
PAL16R4 | STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | ||
PAL16R4 | HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D | TI 德州仪器 | ||
PAL16R4 | HIGH-PERFORMANCE IMPACT-X™ PAL® CIRCUITS High-Performance Operation: fmax (w/o feedback) TIBPAL16R’-10C Series . . . 62.5 MHz Min TIBPAL16R’-12M Series . . . 56 MHz Min fmax (with feedback) TIBPAL16R’-10C Series . . . 55.5 MHz Min TIBPAL16R’-12M Series . . . 48 MHz Min Propagation Delay TIBPAL16L’-10C Series . . . 10 ns Max TIBP | TI 德州仪器 | ||
PAL16R4 | HIGH-PERFORMANCE IMPACT E PAL) CIRCUITS High-Performance Operation: Propagation Delay C Suffix . . . 15 ns Max M Suffix . . . 20 ns Max Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pin | TI 德州仪器 | ||
PAL16R4 | LOW-POWER HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS High-Performance Operation: Propagation Delay C Suffix . . . 25 ns Max M Suffix . . . 30 ns Max Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pin | TI 德州仪器 | ||
PAL16R4 | Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | ||
PAL16R4 | LOW-POWER HIGH-PERFORMANCE IMPACT 文件:645.18 Kbytes Page:27 Pages | TI 德州仪器 | ||
PAL16R4 | STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | ||
20-Pin TTL Programmable Array Logic GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and | AMD 超威半导体 | |||
20-Pin TTL Programmable Array Logic GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and | AMD 超威半导体 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices | TI 德州仪器 | |||
20-Pin TTL Programmable Array Logic GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and | AMD 超威半导体 | |||
标准高速 PAL 电路 | TI 德州仪器 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
标准高速 PAL 电路 | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
可编程逻辑器件(CPLD/FPGA) | AMD 超威半导体 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
STANDARD HIGH-SPEED PAL CIRCUITS 文件:357.21 Kbytes Page:18 Pages | TI 德州仪器 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | |||
Progammable Array Logic Series 24 (PAL Series 24) 文件:448.59 Kbytes Page:14 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 |
PAL16R4产品属性
- 类型
描述
- 型号
PAL16R4
- 制造商
Rochester Electronics LLC
- 功能描述
- Bulk
- 制造商
Advanced Micro Devices
- 制造商
AMD
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
LCCC-20 |
907 |
深耕行业12年,可提供技术支持。 |
|||
MMI |
24+ |
NA/ |
3388 |
原厂直销,现货供应,账期支持! |
|||
MMI |
23+ |
NA |
6500 |
全新原装假一赔十 |
|||
MMI |
24+ |
DIP20 |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
|||
Advanced Micro Devices |
24+ |
DO-214AC |
460150 |
原厂原装 |
|||
TI |
三年内 |
1983 |
只做原装正品 |
||||
MMI |
25+ |
DIP-20 |
65428 |
百分百原装现货 实单必成 |
|||
AMD |
24+ |
DIP20 |
880000 |
明嘉莱只做原装正品现货 |
|||
MMI |
24+ |
DIP20 |
20000 |
全新原厂原装,进口正品现货,正规渠道可含税!! |
|||
NS |
23+ |
CDIP |
9823 |
PAL16R4芯片相关品牌
PAL16R4规格书下载地址
PAL16R4参数引脚图相关
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- PAL16L8BMW/883B
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- PAL16L8BCNL
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- PAL16L8BCJ
- PAL16L8B4WC WAF
- PAL16L8B-4MW/883B
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- PAL16L8B-4ML/883B
- PAL16L8B-4MJ/B
- PAL16L8
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- PAL16L1
- PAL16HY
- PAL16H8
- PAL16H6
- PAL16H4
- PAL16H2
- PAL16H1
- PAL16C8
- PAL16C6
PAL16R4数据表相关新闻
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2019-11-1
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