位置:PAL16R4 > PAL16R4详情

PAL16R4中文资料

厂家型号

PAL16R4

文件大小

833.12Kbytes

页面数量

22

功能描述

STANDARD HIGH-SPEED PAL) CIRCUITS

- Bulk

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

PAL16R4数据手册规格书PDF详情

Choice of Operating Speeds

High-Speed, A Devices . . . 25 MHz Min

Half-Power, A-2 Devices . . . 16 MHz Min

Choice of Input/Output Configuration

Package Options Include Both Ceramic DIP

and Chip Carrier in Addition to Ceramic

Flat Package

description

These programmable array logic devices feature

high speed and a choice of either standard or

half-power devices. They combine Advanced

Low-Power Schottky technology with proven

titanium-tungsten fuses. These devices will

provide reliable, high-performance substitutes for

conventional TTL logic. Their easy

programmability allow for quick design of ”custom”

functions and typically results in a more compact

circuit board. In addition, chip carriers are

available for further reduction in board space.

The Half-Power versions offer a choice of

operating frequency, switching speeds, and

power dissipation. In many cases, these

Half-Power devices can result in significant power

reduction from an overall system level.

The PAL16’ M series is characterized for

operation over the full military temperature range

of –55°C to 125°C.

PAL16R4产品属性

  • 类型

    描述

  • 型号

    PAL16R4

  • 制造商

    Rochester Electronics LLC

  • 功能描述

    - Bulk

  • 制造商

    Advanced Micro Devices

  • 制造商

    AMD

更新时间:2025-10-5 10:18:00
供应商 型号 品牌 批号 封装 库存 备注 价格
AMD
23+
PLCC
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SOP8
6000
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AMD
19+
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8700
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25+
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32360
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AMD
25+
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18600
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TI(德州仪器)
24+
LCCC-20
907
深耕行业12年,可提供技术支持。
TI
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70230
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MMI
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CDIP
412
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5000
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