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PAL16R4AMFKB.A中文资料

厂家型号

PAL16R4AMFKB.A

文件大小

833.12Kbytes

页面数量

22

功能描述

STANDARD HIGH-SPEED PAL) CIRCUITS

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

PAL16R4AMFKB.A数据手册规格书PDF详情

Choice of Operating Speeds

High-Speed, A Devices . . . 25 MHz Min

Half-Power, A-2 Devices . . . 16 MHz Min

Choice of Input/Output Configuration

Package Options Include Both Ceramic DIP

and Chip Carrier in Addition to Ceramic

Flat Package

description

These programmable array logic devices feature

high speed and a choice of either standard or

half-power devices. They combine Advanced

Low-Power Schottky technology with proven

titanium-tungsten fuses. These devices will

provide reliable, high-performance substitutes for

conventional TTL logic. Their easy

programmability allow for quick design of ”custom”

functions and typically results in a more compact

circuit board. In addition, chip carriers are

available for further reduction in board space.

The Half-Power versions offer a choice of

operating frequency, switching speeds, and

power dissipation. In many cases, these

Half-Power devices can result in significant power

reduction from an overall system level.

The PAL16’ M series is characterized for

operation over the full military temperature range

of –55°C to 125°C.

更新时间:2025-12-16 15:01:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
2447
CDIP20
100500
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Texas
25+
25000
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TI
23+
DIP
50000
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PAL16R4AMJ
25+
12
12
25+
长期备有现货
500000
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TI
DIP
113
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TI
23+
DIP
8560
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TI
QQ咨询
DIP
172
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TI
2318+
DIP
4862
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TI
24+
DIP
80000
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