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型号 功能描述 生产厂家 企业 LOGO 操作
PAL16R4A

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

PAL16R4A

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

PAL16R4A

标准高速 PAL 电路

TI

德州仪器

丝印代码:PAL16R4A-2MJ;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:PAL16R4A-2MJ;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:PAL16R4AMJ;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:PAL16R4AMJ;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:81036142A;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:81036142A;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

标准高速 PAL 电路

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Thei • Choice of Operating Speeds \n• Half-Power, A-2 Devices . . . 16 MHz Min\n• Choice of Input/Output Configuration\n• Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package\n DEVICE I INPUTS 3-STATE O OUTPUTS REGISTERED Q OUTPUTS I/O PORT S PAL16L8 1;

TI

德州仪器

丝印代码:81036102A;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:81036102A;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:8103610RA;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:8103610RA;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:8103610SA;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:8103610SA;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

可编程逻辑器件(CPLD/FPGA)

AMD

超威半导体

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

PAL16R4A产品属性

  • 类型

    描述

  • Operating temperature range (C):

    -55 to 125

更新时间:2026-8-4 8:11:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MMI
23+
DIP-20
89630
当天发货全新原装现货
MMI
24+
CDIP20
22055
郑重承诺只做原装进口现货
Vantis
26+
-
2724
全新原装正品
MMI
CDIP20
83+
8
全新原装进口自己库存优势
MMI
23+
DIP20
8560
受权代理!全新原装现货特价热卖!
MMI
17+
DIP
6200
100%原装正品现货
ON
23+
SOT-23
12000
全新原装假一赔十
MMI
24+
DIP20
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
TI/德州仪器
25+
DIP20
32360
TI/德州仪器全新特价PAL16R4A2NC即刻询购立享优惠#长期有货
MMI
24+
DIP
66800
原厂授权一级代理,专注汽车、医疗、工业、新能源!

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