型号 功能描述 生产厂家 企业 LOGO 操作
PAL16R4A

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

PAL16R4A

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

PAL16R4A

标准高速 PAL 电路

TI

德州仪器

20-PIN TTL PROGRAMMABLE ARRAY LOGIC

GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and

AMD

超威半导体

20-Pin TTL Programmable Array Logic

GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and

AMD

超威半导体

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

LOW-POWER HIGH-PERFORMANCE IMPACT

文件:645.18 Kbytes Page:27 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

可编程逻辑器件(CPLD/FPGA)

AMD

超威半导体

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

标准高速 PAL 电路

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

PAL16R4A产品属性

  • 类型

    描述

  • 型号

    PAL16R4A

  • 制造商

    Rochester Electronics LLC

  • 功能描述

    81036142A, REPLACES AMD PAL16R4 - Bulk

更新时间:2025-9-24 8:31:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MMI
17+
DIP
6200
100%原装正品现货
N/A
24+
DIP20
114
大批量供应优势库存热卖
TI
23+
LCC
5000
全新原装,支持实单,非诚勿扰
MMI
21+
DIP20
1638
只做原装正品,不止网上数量,欢迎电话微信查询!
AMD
25+
DIP-20
6
百分百原装正品 真实公司现货库存 本公司只做原装 可
TI
24+
长期备有现货
500000
行业低价,代理渠道
TI
23+
NA
20000
MMI
24+
DIP20
37935
郑重承诺只做原装进口现货
MMI
23+
DIP-20
89630
当天发货全新原装现货
MMI
24+
CDIP20
22055
郑重承诺只做原装进口现货

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