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M36W108	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB100ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB100ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB100ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB100ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB100ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB100ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB120ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB120ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB120ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB120ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB120ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AB120ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108ABZM	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108ABZN	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT100ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT100ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT100ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT100ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT100ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT100ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT120ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT120ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT120ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT120ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT120ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108AT120ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108ATZM	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108ATZN	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B100ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B100ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B100ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B100ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B100ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B100ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B120ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B120ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B120ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B120ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B120ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108B120ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108BZM	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108BZN	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T100ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T100ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T100ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T100ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T100ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T100ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T120ZM1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T120ZM5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T120ZM6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T120ZN1T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T120ZN5T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108T120ZN6T	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS
M36W108TZM	8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT	STMICROELECTRONICS 意法半导体	STMICROELECTRONICS

M36W108产品属性

类型
描述
型号
M36W108
制造商
STMICROELECTRONICS
制造商全称
STMicroelectronics
功能描述
8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

M36W108供应商更多...

更新时间：2025-12-29 13:02:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市斌腾达科技有限公司	M36W432T85ZA6T	STMicroelectronics	21+	60-TFBGA	5280	进口原装!长期供应!绝对优势价格(诚信经营	询价
贸泽芯城（深圳）电子科技有限公司	M36W108AT100ZM6T	ST/意法	23+	LBGA-48	3000	一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、	询价
深圳市芯皇电子有限公司	M36W108AT100ZM6	ST	23+	BGA48	6000	专业配单保证原装正品假一罚十	询价
艾睿（深圳）半导体有限公司	M36W216T70ZA6	ST	2447	BGA	100500	一级代理专营品牌!原装正品,优势现货,长期排单到货	询价
深圳市威尔健半导体有限公司	M36W108AT100ZM6T	ST/意法	23+	BGA	50000	全新原装正品现货,支持订货	询价
上海凌岳电子科技有限公司（上海涵恩科技）	M36W432AD10ZA6	ST	2023+	BGA	3000	进口原装现货	询价
深圳市华斯顿科技有限公司	M36W216TI-70ZA6	ST	25+23+	BGA-66	47919	绝对原装正品现货,全新深圳原装进口现货	询价
深圳市毅创腾电子科技有限公司	M36W432T	N/A	23+	BGA	3700	绝对全新原装!现货!特价!请放心订购!	询价
深圳市华来深电子有限公司	M36W432BG70ZA6T	ST	23+	SOP	8650	受权代理!全新原装现货特价热卖!	询价
深圳市柯尔基电子有限公司	M36W108AT100ZM6T	MXIC	23+24	SOP-8	27960	原装现货.优势热卖.终端BOM表可配单	询价

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M36W108规格书下载地址

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M30620ECFP
M30620ECFP
2023-4-23
M30291FCHP#U3A
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M37544G2ASP原装现货
M37544G2ASP原装正品
2021-8-5
M3622-0014-LQ64G 公司现货
M3622-0014-LQ64G 公司现货
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M38503G4AFP#U1，M38503G4ASP#U1，M38503M2A-055SP，M38507F8AFP#U1
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M3821-ALCAA 深圳市拓亿芯电子有限公司，专业代理，分销世界名牌电子元器件，是一家专业化，品牌化的电子元器件，质量第一，诚信经营。
2019-3-7

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M36W108产品属性

M36W108供应商更多...

M36W108芯片相关品牌

M36W108规格书下载地址

M36W108参数引脚图相关

M36W108数据表相关新闻

M30620ECFP

M30291FCHP#U3A

M37544G2ASP原装现货

M3622-0014-LQ64G 公司现货

M38503G4AFP#U1，M38503G4ASP#U1，M38503M2A-055SP，M38507F8AFP#U1

M3821-ALCAA

DdatasheetPDF页码索引