型号 功能描述 生产厂家 企业 LOGO 操作
M36W108B

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108A is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0mm ball pitch and LGA48 1.0mm land pitch. ■ SUPPLY VOLTAGE – VCCF = VCCS = 2.7V to 3.6V: for Program, Era

STMICROELECTRONICS

意法半导体

M36W108B产品属性

  • 类型

    描述

  • 型号

    M36W108B

  • 制造商

    STMICROELECTRONICS

  • 制造商全称

    STMicroelectronics

  • 功能描述

    8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

更新时间:2025-12-29 10:53:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ST
2023+
BGA
3000
进口原装现货
ST
25+23+
BGA-66
47919
绝对原装正品现货,全新深圳原装进口现货
N/A
23+
BGA
3700
绝对全新原装!现货!特价!请放心订购!
ST
23+
SOP
8650
受权代理!全新原装现货特价热卖!
N/A
24+
BGA
6980
原装现货,可开13%税票
25+
BGA
2140
全新原装!现货特价供应
ST
22+
66LFBGA (12x8)
9000
原厂渠道,现货配单
ST
359
SOP
435
原装正品
ST/意法
24+
NA/
2449
优势代理渠道,原装正品,可全系列订货开增值税票
24+
3000
公司存货

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