High current transfer ratio

Features 1.High current transfer ratio. 2.Opaque type, mini-flat package. 3.Subminiature type (The volume is smaller than that of our conventional DIP type by as far as 30%). 4.Isolation voltage between input and output Viso:3750Vrms. 5.Employs double transfer mold technology. 6.Recogniz

KB355NT - 光电耦合器, Transistor Output, 1通道, SOP, 4 引脚, 50 mA, 3.75 kV, 600 %

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing x 0.140” (3.56mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.470” (11.94mm) • Contact termination options include P.C. tail, wire hole, extender board bends • Dual row configuration • Large va

3M??Power Clamp Wiremount Socket

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Introducing Full-featured Level Transmitters with a User-friendly Price Point.

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THRU-HOLE THREADED INSERT W/FLANGE

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True-rms 2000 A Clamp Meters

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