Features

1.High current transfer ratio.

2.Opaque type, mini-flat package.

3.Subminiature type (The volume is smaller than that of our conventional DIP type by as far as 30%).

4.Isolation voltage between input and output Viso:3750Vrms.

5.Employs double transfer mold technology.

6.Recognized by UL and CUL, file NO.E225308.

7.Approved by VDE 0884 Teil2(NO:40017614).

8.Moisture Sensitivity Level : Level 4.

9..Package : 1000Pcs / Reel.

10.RoHS Compliant.

Applications

1.Hybrid substrates that require high density mounting.

2.Programmable controllers.