HiPerRFTM Power MOSFETs

HiPerRF™ Power MOSFETs F-Class: MegaHertz Switching N-Channel Enhancement Mode Avalanche Rated, Low Qg, Low Intrinsic Rg High dV/dt, Low trr Features ● RF capable Mosfets ● Rugged polysilicon gate cell structure ● Double metal process for low gate resistance ● Unclamped

isc N-Channel MOSFET Transistor

FEATURES ·Drain Current –ID= 55A@ TC=25℃ ·Drain Source Voltage- : VDSS= 500V(Min) ·Static Drain-Source On-Resistance : RDS(on) = 85mΩ(Max)@VGS= 10V ·100 avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation DESCRIPTION ·motor drive, DC-DC co

HiPerRF Power MOSFETs

HiPerFET™ Power MOSFET F-Class: MegaHertz Switching N-Channel Enhancement Mode Avalanche Rated, Low Qg, Low Intrinsic Rg High dV/dt, Low trr Features • RF capable Mosfets • Rugged polysilicon gate cell structure • Double metal process for low gate resistance • Unclamped

HiPerFET Power MOSFET

HiPerFET™ Power MOSFET Single Die MOSFET Features • International standard packages • Encapsulating epoxy meets UL 94 V-0, flammability classification • miniBLOC with Aluminium nitride isolation • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell structure • Unc

HiPerFET Power MOSFET

HiPerFET™ Power MOSFET Single Die MOSFET Features • International standard packages • Encapsulating epoxy meets UL 94 V-0, flammability classification • miniBLOC with Aluminium nitride isolation • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell structure • Unc

HiPerFETTM Power MOSFET

HiPerFET Power MOSFET Single Die MOSFET Features • Low cost direct-copper bonded aluminium package • Encapsulating epoxy meets UL 94 V-0, flammability classification • 2500V isolation • Low drain to case capacitance • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell structure •

HiPerFET Power MOSFETs ISOPLUS247

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