型号 功能描述 生产厂家 企业 LOGO 操作
IS43DR81280B

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

IS43DR81280B

1.8V DDR2 SDRAM

ISSI

矽成半导体

IS43DR81280B

1Gb (x8, x16) DDR2 SDRAM

文件:549.15 Kbytes Page:28 Pages

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

文件:863.44 Kbytes Page:28 Pages

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

动态随机存储器(DRAM)

ETC

知名厂家

封装/外壳:60-TFBGA 包装:卷带(TR) 描述:IC DRAM 1GBIT PARALLEL 60TWBGA 集成电路(IC) 存储器

ETC

知名厂家

封装/外壳:60-TFBGA 包装:卷带(TR) 描述:IC DRAM 1GBIT PARALLEL 60TWBGA 集成电路(IC) 存储器

ETC

知名厂家

1Gb (x8, x16) DDR2 SDRAM

文件:855.01 Kbytes Page:28 Pages

ISSI

矽成半导体

Differential data strobe

文件:1.5625 Mbytes Page:49 Pages

ISSI

矽成半导体

更新时间:2026-3-2 18:31:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ISSI
2223+
BGA60
26800
只做原装正品假一赔十为客户做到零风险
ISSI, Integrated Silicon Solut
18500
全新原厂原装现货!受权代理!可送样可提供技术支持!
ISSI
21+
BGA60
1975
ISSI
2022+
6600
只做原装,假一罚十,长期供货。
ISSI
24+
BGA60
66500
只做全新原装进口现货
ISSI
2407+
IC
30098
全新原装!仓库现货,大胆开价!
ISSI Integrated Silicon Soluti
22+
60TWBGA (10.5x8)
9000
原厂渠道,现货配单
ISSI
24+
n/a
25836
新到现货,只做原装进口
ISSI/矽成
1836
DDR2SDRAM/128MX8DDR2/3=u
7215
原装香港现货真实库存。低价
ISSI
24+
BGA60
63522
只做原装现货热卖可出样品

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