型号 功能描述 生产厂家 企业 LOGO 操作
IS43DR81280

1Gb (x8, x16) DDR2 SDRAM

文件:863.44 Kbytes Page:28 Pages

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4‐bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency‐1  Programmable Burst Sequence: Sequential

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

FEATURES  Clock frequency up to 400MHz  8 internal banks for concurrent operation  4-bit prefetch architecture  Programmable CAS Latency: 3, 4, 5, 6 and 7  Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6  Write Latency = Read Latency-1  Programmable Burst Sequence: Sequential o

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

文件:855.01 Kbytes Page:28 Pages

ISSI

矽成半导体

1.8V DDR2 SDRAM

ISSI

矽成半导体

1Gb (x8, x16) DDR2 SDRAM

文件:549.15 Kbytes Page:28 Pages

ISSI

矽成半导体

封装/外壳:60-TFBGA 包装:托盘 描述:IC DRAM 1GBIT PARALLEL 60TWBGA 集成电路(IC) 存储器

ETC

知名厂家

动态随机存储器(DRAM)

ETC

知名厂家

封装/外壳:60-TFBGA 包装:卷带(TR) 描述:IC DRAM 1GBIT PARALLEL 60TWBGA 集成电路(IC) 存储器

ETC

知名厂家

1.8V DDR2 SDRAM

ISSI

矽成半导体

Differential data strobe

文件:1.5625 Mbytes Page:49 Pages

ISSI

矽成半导体

更新时间:2026-3-2 23:55:00
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只做原装,假一罚十,长期供货。
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原厂全新正品旗舰店优势现货
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专营ISSI进口原装正品假一赔十可開17增值稅票
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代理原装现货,价格优势
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##公司主营品牌长期供应100%原装现货可含税提供技术
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原装进口价格优 请找坤融电子!

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