Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipa

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipa

Power MOSFET

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Power MOSFET

文件：1.15569 Mbytes Page：9 Pages

HEXFET Power MOSFET

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Power MOSFET

HEXFET Power MOSFET

Advanced Power MOSFET

BVDSS = 100 V RDS(on) = 0.44Ω ID = 5.6 A FEATURES ♦ Logic-Level Gate Drive ♦ Avalanche Rugged Technology ♦ Rugged Gate Oxide Technology ♦ Lower Input Capacitance ♦ Improved Gate Charge ♦ Extended Safe Operating Area ♦ Lower Leakage Current: 10µA (Max.) @ VDS = 100V ♦ Lower RDS(ON): 0.33

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipa

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipa

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It prov

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It prov

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It prov

Power MOSFET

Power MOSFET

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isc N-Channel MOSFET Transistor

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Power MOSFET

文件：1.15569 Mbytes Page：9 Pages

HEXFET POWER MOSFET

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HEXFET POWER MOSFET

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PISTON SEALS

DESCRIPTION The BECA 510 profile is a highperforming, double acting compact piston seal composed of two POM wear/back-up rings, a polyurethane friction ring for dynamic applications and a flexible pre-tightened NBR ring. It can be assembled in a groove according to standard ISO 6547. 

510/511 All Welded Diaphragm Seal

FEATURES Compact design allows seals to fit in confined areas Sufficient displacement to drive a wide variety of instrumentation Minimal fill volume All stainless steel construction; other materials available Light weight design

ROUND INSTRUMENTATION HANDLES

[KEYSTONE] ROUND INSTRUMENTATION HANDLES FERRULES HANDLE MOUNTING SCREWS

Copper Clad Boards 500 Series Technical Data Sheet

Description The 500 Series Copper Clad Boards are made of a laminate consisting of continuous woven glass cloth impregnated with epoxy resin. The boards are made of FR4 which is a flame retardant version of G-10 material. Applications & Usages The boards are ideal for prototyping and small pr

Innovative Pocket-Sized Measurement Technology

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