Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It prov

HEXFET POWER MOSFET

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HEXFET POWER MOSFET

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It prov

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It prov

Power MOSFET

ROUND INSTRUMENTATION HANDLES

[KEYSTONE] ROUND INSTRUMENTATION HANDLES FERRULES HANDLE MOUNTING SCREWS

510/511 All Welded Diaphragm Seal

FEATURES Compact design allows seals to fit in confined areas Sufficient displacement to drive a wide variety of instrumentation Minimal fill volume All stainless steel construction; other materials available Light weight design

PISTON SEALS

DESCRIPTION The BECA 510 profile is a highperforming, double acting compact piston seal composed of two POM wear/back-up rings, a polyurethane friction ring for dynamic applications and a flexible pre-tightened NBR ring. It can be assembled in a groove according to standard ISO 6547. 

Aluminum Capacitors 125 °C, Miniature, Radial Lead

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LINEAR AND ROTARY POSITION

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