HEXFET POWER MOSFET

Through-Hole Packags TO-220 FullPak (Fully Isolated)

Power MOSFET

FEATURES • Isolated package • High voltage isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz) • Sink to lead creepage distance = 4.8 mm • 175 °C operating temperature • Dynamic dV/dt rating • Low thermal resistance • Material categorization: for definitions of compliance please see www.vishay.co

Power MOSFET

FEATURES • Isolated package • High voltage isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz) • Sink to lead creepage distance = 4.8 mm • 175 °C operating temperature • Dynamic dV/dt rating • Low thermal resistance • Material categorization: for definitions of compliance please see www.vishay.co

isc N-Channel MOSFET Transistor

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HEXFET POWER MOSFET

Power MOSFET

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Power MOSFET

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iscN-Channel MOSFET Transistor

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Power MOSFET

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Power MOSFET

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ROUND INSTRUMENTATION HANDLES

[KEYSTONE] ROUND INSTRUMENTATION HANDLES FERRULES HANDLE MOUNTING SCREWS

PISTON SEALS

DESCRIPTION The BECA 510 profile is a highperforming, double acting compact piston seal composed of two POM wear/back-up rings, a polyurethane friction ring for dynamic applications and a flexible pre-tightened NBR ring. It can be assembled in a groove according to standard ISO 6547. 

510/511 All Welded Diaphragm Seal

FEATURES Compact design allows seals to fit in confined areas Sufficient displacement to drive a wide variety of instrumentation Minimal fill volume All stainless steel construction; other materials available Light weight design

Innovative Pocket-Sized Measurement Technology

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Aluminum Capacitors 125 °C, Miniature, Radial Lead

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