RoHs Compliant Containing No Lead and Bromide

Description The IRF8308MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

RoHs Compliant Containing No Lead and Bromide

Description The IRF8308MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

Dual Sided Cooling Compatible

文件：271.83 Kbytes Page：10 Pages

Dual Sided Cooling Compatible

文件：271.83 Kbytes Page：10 Pages

Connector Modules with Intergrated LAN Magnetics

[FILTRAN] • Unique layout conserves precious circuit board space • Designed for HUB applications • IEEE 802.3u • Compliant with a wide assortment of ICs • Primary center taps available for additional EMI reduction

RJ-45 Connector Modules with Intergrated LAN Magnetics

• Unique layout conserves precious circuit board space • Designed for HUB applications • IEEE 802.3u • Compliant with a wide assortment of ICs • Primary center taps available for additional EMI reduction

RS-232, Low Cap, #22-8pr, SR-PVC, O/A FoilBraid, PVC Jkt, CMG

Product Description Computer EIA RS-232 Cable, 22 AWG stranded (7x30) tinned copper conductors, semi-rigid PVC insulation, 8 twisted pairs, overall Beldfoil® (100 coverage) tinned copper braid shield (65 coverage), PVC jacket.

Wire-Thread-Inserts

文件：102.37 Kbytes Page：3 Pages

Connector Modules with Intergrated LAN Magnetics

文件：717.17 Kbytes Page：1 Pages