DirectFet Power MOSFET Typical values (unless otherwise specified)

Description The IRF6662 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout ge

DirectFET??Power MOSFET

Description The IRF6662PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

DirectFET??Power MOSFET

Description The IRF6662PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

Application Specific MOSFETs

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Application Specific MOSFETs

文件：253.61 Kbytes Page：10 Pages

Application Specific MOSFETs

文件：253.61 Kbytes Page：10 Pages

Benchmark MOSFETs Product Selection Guide

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LIN Transceiver

Description The ATA6662 is a fully integrated LIN transceiver complying with the LIN specification 2.0, 2.1 and SAEJ2602-2. It interfaces the LIN protocol handler and the physical layer. The device is designed to handle the low-speed data communication in vehicles, for example, in convenience e

SCANNER ANALOG FRONT END

GENERAL DESCRIPTION The W6662 is a highly integrated CCD/CIS analog front end signal processor. It provides the components required for all necessary front-end signal process of a CCD/CIS scanner, including a 3-channel input clamp circuit for correlated double sampling (short as CDS) mode, a mult

12-Bit Sign Temperature Sensor with SPI-Compatible Serial Interface

文件：133.44 Kbytes Page：9 Pages

12-Bit Sign Temperature Sensor with SPI-Compatible Serial Interface

文件：133.44 Kbytes Page：9 Pages