Power MOSFET(Vdss=-55V, Rds(on)=0.06ohm, Id=-31A)

Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, pr

Advanced Process Technology

Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provi

-55V P-Channel MOSFET

Features VDS (V) =-55V ID = -31A (VGS = -10V) RDS(ON)

-55V 单个 P 通道 HEXFET Power MOSFET, 采用 TO-220AB 封装

P-Channel MOSFET Transistor

文件：334.6 Kbytes Page：2 Pages

Advanced Process Technology

Description The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low inte

Power MOSFET(Vdss=-55V, Rds(on)=0.06ohm, Id=-31A)

Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for,

HEXFET Power MOSFET

Advanced Process Technology

-60V P-Channel MOSFET

Features * VDS (V) = -60V * ID = -31A (VGS = -10V) * RDS(ON)

-55V P-Channel MOSFET

Features VDS (V) =-55V ID = -31A (VGS = -10V) RDS(ON)

Power MOSFET(Vdss=-55V, Rds(on)=0.06ohm, Id=-31A)

Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for,

Advanced Process Technology

Description The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low inte

Advanced Process Technology

HEXFET Power MOSFET

-55V P-Channel MOSFET

Features * VDS (V) =-55V * ID = -31A (VGS = -10V) * RDS(ON)

isc P-Channel MOSFET Transistor

文件：272.87 Kbytes Page：2 Pages

HEXFET Power MOSFET

HEXFET Power MOSFET

文件：179.17 Kbytes Page：8 Pages

Advanced Process Technology

文件：188.38 Kbytes Page：9 Pages

-55V 单个 P 通道 HEXFET Power MOSFET, 采用 D2-Pak 封装

Advanced Process Technology

文件：706.19 Kbytes Page：11 Pages

isc P-Channel MOSFET Transistor

文件：297.21 Kbytes Page：2 Pages

Advanced Process Technology

文件：706.19 Kbytes Page：11 Pages

ADVANCED PROCESS TECHNOLOGY

文件：706.19 Kbytes Page：11 Pages

HEXFET짰 Power MOSFET

文件：366.79 Kbytes Page：12 Pages

P-Channel 60 V (D-S) MOSFET

文件：1.59267 Mbytes Page：7 Pages

Advanced Process Technology

文件：706.19 Kbytes Page：11 Pages

T-1 3/4 Tricolor Right Angle LED Assembly

Features • Block mounting, height and spacing alignment saves assembly cost and time. • Super Brite LEDs-high intensity light output • Press-in pin secures block to board for solder • Press-in pin secures block to board for soldering.ing. • Standoffs prevent flux entrapment.

T-1 3/4 Tricolor Right Angle LED Assembly

Features • Block mounting, height and spacing alignment saves assembly cost and time. • Super Brite LEDs-high intensity light output • Press-in pin secures block to board for soldering. • Press-in pin secures block to board for soldering. • Standoffs prevent flux entrapment.

BNC (Female) To SMD Grabber Test Clips

FEATURES: • Converts BNC (male) cables / connectors to SMD test clips for test versatility. • Grabber pincer and BNC center contact are gold plated excellent corrosion resistance and low contact resistance to ensure test signal integrity. • BNC connector is molded directly to the wire for pull

Rod, Expanding/Cross-Plate Anchor, 1/2in X 5ft Thimbleye

文件：366.84 Kbytes Page：1 Pages

24 (7/32) AWG Tinned Copper

文件：413.16 Kbytes Page：4 Pages