Description

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the

highest power capability and the lowest possible on resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF5305L) is available for low profile applications.

l Advanced Process Technology

l Surface Mount (IRF5305S)

l Low-profile through-hole (IRF5305L)

l 175°C Operating Temperature

l Fast Switching

l P-Channel

l Fully Avalanche Rated