Power MOSFET(Vdss=-55V, Rds(on)=0.06ohm, Id=-31A)

Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for,

Advanced Process Technology

Description The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low inte

isc P-Channel MOSFET Transistor

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Advanced Process Technology

HEXFET Power MOSFET

HEXFET Power MOSFET

BNC (Female) To SMD Grabber Test Clips

FEATURES: • Converts BNC (male) cables / connectors to SMD test clips for test versatility. • Grabber pincer and BNC center contact are gold plated excellent corrosion resistance and low contact resistance to ensure test signal integrity. • BNC connector is molded directly to the wire for pull

T-1 3/4 Tricolor Right Angle LED Assembly

Features • Block mounting, height and spacing alignment saves assembly cost and time. • Super Brite LEDs-high intensity light output • Press-in pin secures block to board for solder • Press-in pin secures block to board for soldering.ing. • Standoffs prevent flux entrapment.

T-1 3/4 Tricolor Right Angle LED Assembly

Features • Block mounting, height and spacing alignment saves assembly cost and time. • Super Brite LEDs-high intensity light output • Press-in pin secures block to board for soldering. • Press-in pin secures block to board for soldering. • Standoffs prevent flux entrapment.

Rod, Expanding/Cross-Plate Anchor, 1/2in X 5ft Thimbleye

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24 (7/32) AWG Tinned Copper

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