型号 功能描述 生产厂家&企业 LOGO 操作

3.3 VOLT HIGH-DENSITY SUPERSYNC II

DESCRIPTION: The IDT72V36100/72V36110 are exceptionally deep, high speed, CMOS First-In-First-Out (FIFO) memories with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. These FIFOs offer several key user benefits: • Flexible x36/x18/x9 Bus-Matching on both read an

IDT

3.3 VOLT HIGH-DENSITY SUPERSYNC II

DESCRIPTION: The IDT72V36100/72V36110 are exceptionally deep, high speed, CMOS First-In-First-Out (FIFO) memories with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. These FIFOs offer several key user benefits: • Flexible x36/x18/x9 Bus-Matching on both read an

IDT

3.3 VOLT HIGH-DENSITY SUPERSYNC II™ 36-BIT FIFO 65,536 x 36 131,072 x 36

FEATURES: • Choose among the following memory organizations: 72V36100 ⎯ 65,536 x 36 72V36110 ⎯ 131,072 x 36 • Higher density, 2Meg and 4Meg SuperSync II FIFOs • Up to 166 MHz Operation of the Clocks • User selectable Asynchronous read and/or write ports (CABGA Only) • User selectable input

RENESAS

瑞萨

3.3 VOLT HIGH-DENSITY SUPERSYNC II™ 36-BIT FIFO 65,536 x 36 131,072 x 36

FEATURES: • Choose among the following memory organizations: 72V36100 ⎯ 65,536 x 36 72V36110 ⎯ 131,072 x 36 • Higher density, 2Meg and 4Meg SuperSync II FIFOs • Up to 166 MHz Operation of the Clocks • User selectable Asynchronous read and/or write ports (CABGA Only) • User selectable input

RENESAS

瑞萨

3.3 VOLT HIGH-DENSITY SUPERSYNC II

DESCRIPTION: The IDT72V36100/72V36110 are exceptionally deep, high speed, CMOS First-In-First-Out (FIFO) memories with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. These FIFOs offer several key user benefits: • Flexible x36/x18/x9 Bus-Matching on both read an

IDT

IDT72V36110L6PFG产品属性

  • 类型

    描述

  • 型号

    IDT72V36110L6PFG

  • 功能描述

    IC FIFO SYNC 131KX36 6NS 128QFP

  • RoHS

  • 类别

    集成电路(IC) >> 逻辑 - FIFO

  • 系列

    72V

  • 标准包装

    90

  • 系列

    74ABT

  • 功能

    同步,双端口

  • 存储容量

    4.6K(64 x 36 x2)

  • 数据速率

    67MHz

  • 访问时间

    -

  • 电源电压

    4.5 V ~ 5.5 V

  • 工作温度

    0°C ~ 70°C

  • 安装类型

    表面贴装

  • 封装/外壳

    120-LQFP 裸露焊盘

  • 供应商设备封装

    120-HLQFP(14x14)

  • 包装

    托盘

  • 产品目录页面

    1005(CN2011-ZH PDF)

  • 其它名称

    296-3984

更新时间:2025-8-14 18:01:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
RENESAS(瑞萨)/IDT
24+
PBGA144(13x13)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
IDT, Integrated Device Technol
21+
128-LQFP
36
100%进口原装!长期供应!绝对优势价格(诚信经营)
Renesas
25+
电联咨询
7800
公司现货,提供拆样技术支持
RENESAS(瑞萨电子)
22+
NA
500000
万三科技,秉承原装,购芯无忧
IDT, Integrated Device Technol
24+
144-PBGA(13x13)
53200
一级代理/放心采购
RENESAS(瑞萨)/IDT
2447
PBGA-144(13x13)
315000
1个/托盘一级代理专营品牌!原装正品,优势现货,长期
24+
N/A
64000
一级代理-主营优势-实惠价格-不悔选择
RENESAS(瑞萨)/IDT
2021+
PBGA-144(13x13)
499
IDT
20+
BGA-144
10
就找我吧!--邀您体验愉快问购元件!

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