High Performance ChipLED

Description These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. Features • Small size • Industry standard footprint • Compatible with IR solder • Diffused optics • Opera

High Performance ChipLED

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High Performance ChipLED

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封装/外壳：0805（2012 公制） 包装：带盒（TB） 描述：LED ORANGE DIFFUSED CHIP SMD 光电器件 LED 指示 - 分立

Broadcom HSML-C170 High Performance ChipLED

HSML-C170-T0000 High Performance ChipLED

封装/外壳：0805（2012 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：LED ORANGE ALINGAP TOP MT 光电器件 LED 指示 - 分立

High Performance Surface Mount ChipLED

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Surface Mount TRANSZORB Transient Voltage Suppressors

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 • Excellent clamping capability • Very fast r

ROD SEALS

DESCRIPTION The BECA 170 - 179 profiles are double acting composite rod seals composed of a filled PTFE friction ring and pre-tightened rubber O'Ring. They can be mounted in the grooves of the O'Rings. Option of connecting the seal to 1 or 2 back-up rings. APPLICATIONS Machine tools

Hard Wired 170 Series

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Custom Power Modules

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RUGGED and LIGHTWEIGHT ALUMINUM BATTERY HOLDERS

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