CustomPowerModules

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RUGGEDandLIGHTWEIGHTALUMINUMBATTERYHOLDERS

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HardWired170Series

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包装：散装 描述：BATT HLDR AAA 4 CELL SOLDER LUG 电池产品 电池座，电池夹，电池触头

包装：散装 描述：CUTTER SHEARS TPRD FLUSH 5.13\ 工具 钢丝钳

RadialLeadInductors

DESCRIPTION The1700Seriesisageneral-purposerangeofinductorssuitableforlowtomediumcurrentapplications.Theirsmallfootprintmakesthemidealforhigh-densityapplicationswhereachipinductorwillnotcopewiththepowerrequirement. FEATURES ■RadialFormat ■Upto1

Intel®Core™i7/i5/i3/CeleronBGA1356Mini-ITXwithDP/HDMI/LVDS(eDP),2COM,DualLAN,miniPCIe,DDR4,DCInput

Features ƒƒSupportsIntel®Core™corei7-6600u/corei5-6300u/corei3-6100u/ celeron3955u/i7-7600u/i5-7300u/i3-7100u/Celeron3965u,15WTDP,BGA 1356,14nmProcessor ƒƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒƒMultipledisplayI/OsupportsversatileTridisplayfunctionsforHD

Intel®Core™i7/i5/i3/CeleronBGA1528Mini-ITXwithTypeCAlt./HDMI/LVDS(eDP),6COM,DualLAN,M.2(miniPCIe),PCIex1,DDR4,DCInput,widetemprature

Features ƒSupportsIntel®Core™corei7-8665UE/i5-8365UE/I3-8145UE/Celereon 4305UE,15WTDP,BGA152816nmProcessor ƒTwo260-pinSO-DIMMupto64GBDDR42400MHzSDRAM ƒMultipledisplayI/OsupportsversatileTridisplayfunctionsforHDMI, TypeCAlt.,LVDS(eDP) ƒSupportPCIex1,2M.

Intel®Core™i7/i5/i3/CeleronBGA1528Mini-ITXwithTypeCAlt./HDMI/LVDS(eDP),6COM,DualLAN,M.2(miniPCIe),PCIex1,DDR4,DCInput,widetemprature

Features ƒSupportsIntel®Core™corei7-8665UE/i5-8365UE/I3-8145UE/Celereon 4305UE,15WTDP,BGA152816nmProcessor ƒTwo260-pinSO-DIMMupto64GBDDR42400MHzSDRAM ƒMultipledisplayI/OsupportsversatileTridisplayfunctionsforHDMI, TypeCAlt.,LVDS(eDP) ƒSupportPCIex1,2M.

AIInferenceSystemBasedonNVIDIA®JetsonAGXOrin

Features ƒCompactandhighperformanceAIboxupto275TOPSAIcomputing ƒNVIDIA®JetsonAGXOrinbuilt-in ƒ9~36Vwidepowerand-10~50°Cwidetemp.supported ƒMultipleIOports:3xLAN,DIO,4xCOM,4xUSB3.2andUSBtypeC ƒSupportvariousexpansions1xM.22280(NVME),1xM.2223

EdgeAIInferenceSystemwithIntelAtom®E3940QCSoCandTwoIntelMA2485VPUs

Features ƒIntelAtom®E3940QuadCoreSoCturboburstupto1.8GHz ƒIntel®Movidius™Myriad™XVPUMA2485x2Built-in ƒIntel®OpenVINO™toolkitsupported ƒSATASlim64GSSDx1Built-in ƒ204-pinSO-DIMMDDR3L8GBmemoryx1built-in ƒDIN-RailAIsystemwithessentialI/Oportsonfron

IntelAtomx6413EQCSoCwithHDMIandDP/DualLAN/DualCOMDIN-RailFan-lessBoxPC

Features ƒIntelAtomx6413EQuadCoreSoCturboburstupto3.00GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand2xRS-232/422/485 ƒDualindependentdisplayswithone4KHDMIandone4KDP ƒ1xM.22280BkeywithnanoSIMholderand1xM.22230Ek

Intel®12thGenXeon®WCore™i3/i5/i7/i9LGA1700ExpansionFanlessBoxPC

Features ƒSupportIntel®12thGen.Xeon®WandCore™i3/i5/i7/i9processor ƒTripleindependentdisplay:HDMI+HDMI+OptionalDisplay ƒDDR5SO-DIMMECC/non-ECCmemorysupportupto64GB ƒ9-36VDCwiderangepowerinput ƒUpto3sets2.5harddrivebays,supportIntel®SWRAID ƒSupport

Intel®11thgenCore™iprocessorwithTripleLAN/QuadrupleCOMDin-RailFanlessBoxPC

Features ƒIntel11thgen.Corei5/i3 ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ3xIntelGbE,4xRS-232/422/485,8-bitDIO,optionalCANBus ƒ3Expansions:M.2E-Key2230,M.2B-Key2280,1xFull-sizemSATAshare withmPCIeslot ƒDualindependentdisplayswithone4

IntelCeleronQuadCoreJ1900SoCwith6COMand8USBFanlessBoxPC

Features ƒIntelCeleronQuadCoreJ19002.0GHzSoC ƒDDR3L1333MHzSO-DIMMmemorysupportupto8GB ƒDualdisplay:VGA+DisplayPort ƒSupport1x3.5or2.5SATAHDDBayandmSATA ƒMultipleI/O:1xUSB3.0,7xUSB2.0,2xLANand6xCOM ƒSupport1xFull-sizeand1xhalf-sizeMin

Intel®4thGenerationCorei54300U/Celeron2980USoCSlimandPanelMountableFanlessBoxPC

Features ƒIntel®DualCoreCeleron2980U1.6GHz/Corei54300U1.9GHzSoC ƒOneSwappable2.5SATAHDDBayandmSATAslot ƒTripleIndependentDisplaysbyVGA+HDMI ƒOptionalVESA/DINRailMountingkits ƒSupports2xIntelGbEand1xGPIO ƒBuilt-in1xfullsizeMiniPCIe ƒLockab

6thGen.Intel®Core™i3/i5/i7ModularExpansionFanlessBoxPC

Features ƒ6thGen.Intel®Core™i3/i5/i7mobileprocessor(BGA) ƒTripleindependentdisplay:VGA+HDMI+OptionalDisplay ƒDDR4SO-DIMMmemorysupportupto32GB ƒOption9-36Vpowermodulecompatiblewithall-in-oneordering ƒOptionalmodulardesignfor2.5harddrivebays:internal/

Intel®Celeron™N3350DCSoCWithFourSerialPortsModularFanlessBoxPC

Features ƒIntel®Celeron™N3350DualCoreSoC ƒVGADisplay,4xRS-232/422/485,2xUSB3.0 ƒ1xfull-sizeminiPCIeforcommunicationmodule#1 ƒ1x2.5SATAIIIdrivebayand1xhalf-sizemSATA ƒ-20~60°Cextendedoperatingtemperature ƒ12VlockableDCjackpowerinput ƒOptional1

Intel®Xeon®E3/Core™i3/i5/i7LGA1151ModularExpansionFanlessBoxPC

Features ƒSupportIntel®Xeon®/6th&7thGen.Core™i3/i5/i7processor ƒTripleindependentdisplay:VGA+HDMI+OptionalDisplay ƒDDR4SO-DIMMmemorysupportupto32GB ƒOption9-36Vpowermodulecompatiblewithall-in-oneordering ƒOptionalmodulardesignfor2.5harddrivebays:in

Intel®Atom™E3940QCSoCWithDualHDMI/DualLAN/FourUSBModularFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoC ƒDualHDMIindependentdisplaysupport4Kresolution ƒ1xFull-sizeminiPCIewithSIMholderforcommunicationmodule#1 ƒ1xM.22230EKeyforWIFImodule#2 ƒ1x2.5SATAIIISSD/HDDand1xmSATA ƒTPMbuiltinforsystemsecurity ƒ-20~

Intel®10thGenXeon®W/Core™iLGA1200ExpansionFanlessBoxPC

Features ƒSupportIntel®10thGen.Xeon®WandCore™i3/i5/i7/i9processor ƒTripleindependentdisplay:VGA+HDMI+OptionalDisplay ƒDDR4SO-DIMMECC/non-ECCmemorysupportupto64GB ƒ12-36VDCwiderangepowerinput ƒUpto4sets2.5harddrivebays,supportIntel®SWRAID ƒSupport

Intel®Celeron™N3350DCSoCWithDualLAN/FourUSB3.0/M.2/TPMIoTGatewayModularFanlessBoxPC

Features ƒIntel®Celeron™N3350DualCoreSoC ƒVGADisplay/2xRS-232/422/485/4xUSB3.0 ƒ1xFull-sizeminiPCIewithSIMholderforcommunicationmodule#1 ƒ1xM.2E-keyforWIFImodule#2 ƒ-20~60°Cextendedoperatingtemperature ƒTPM2.0defaultbuilt-in ƒ12VlockableDCjackpo

IntelAtomE3940QCSoCwithisolatedGbEandCOMportsDIN-RailFanlessBoxPC

Features ƒIntelAtomE3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIsolatedIntelGbEwithprotectionto2.5KVDC ƒ2xIsolatedCOMwithprotectionto2.5KVDC ƒIsolated8bitGPIO(4DI/4DO)withwithprotectionto2.5KV

Intel®10thGenXeon®W/Core™iLGA1200ExpansionFanlessBoxPC

Features ƒSupportIntel®10thGen.Xeon®WandCore™i3/i5/i7/i9processor ƒTripleindependentdisplay:VGA+HDMI+OptionalDisplay ƒDDR4SO-DIMMECC/non-ECCmemorysupportupto64GB ƒ12-36VDCwiderangepowerinput ƒUpto4sets2.5harddrivebays,supportIntel®SWRAID ƒSupport

Intel®Atom™E3940QCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand4xUSB3.0 ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-sizemPCIewithSIMholderand1xM.22230forWIFI#1 ƒ1x2.5SATAIIIS

Intel®Atom™E3940QCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand4xUSB3.0 ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-sizemPCIewithSIMholderand1xM.22230forWIFI#1 ƒ1x2.5SATAIIIS

17SXGAIndustrialOpenFrameMonitor

Features ƒƒ17SXGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒƒ-20°C~+60°Cwiderangeoperatingtemperature ƒƒ5-wireresistivetouchscreensolution ƒƒCombotouchinterfaceofRS-232andUSB ƒƒDualsignalinterfacewithVGA&DVI ƒƒIntegratedbr

19SXGAIndustrialOpenFrameMonitor

Features ƒƒ19SXGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒƒ0°C~+45°Coperatingtemperature ƒƒ5-wireresistivetouchscreensolution ƒƒCombotouchinterfaceofRS232andUSB ƒƒDualsignalinterfacewithVGA&DVI ƒƒIntegratedbracketforeasy

19SXGAIndustrialPanelMountMonitor

Features ƒƒ19SXGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒƒ0°~+45°Coperatingtemperature ƒƒ5-wireresistivetouchscreensolutionor3mmtemperedsmudgeresistant protectedglass ƒƒCombotouchinterface:RS-232andUSB ƒƒDualsignalinterface

AMDV-series/R-seriesmini-ITXwith4DP,6USB,6COM,12-24VDC-In

Features ƒSupportAMDV1000/R1000processor ƒTwo260-pinSO-DIMMupto32GBDDR42400/2666/3200SDRAM ƒSupportmultidisplay,Maxupto4displays ƒSupports1PCIex8,1xPCIex1(Goldenfinger)and2M.2expansionslots ƒ6COM,4USB2.0,2USB3.1Gen2 ƒSupportsWISE-PaaS/RMMandEmbed

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®AtomQuadCore/DualCoreProcessor ƒPalm-sizeformfactor:170(L)x117(W)x52.6mm(H) ƒSupports2xLAN,2xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,andDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFullsize MiniPC

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®ApolloLakeE3900seriesProcessor ƒPalm-sizeformfactor:170X117X52.6mm ƒSupports3xLAN,4xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,16bitGPIO,Audioin/outandDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFull

Simplifyingthemulti-cloudwithadomainfocusapplication

Features ƒHigh-performanceedgecloudserverwithIntel®10thGen.Xeon®Wand Core™i3/i7processor ƒAvailablewithopenandstandardstructure:Kubernetes(MicroK8S)built-in, multipleDBconnections,andon-demandmicro-services ƒIntegratedIoTsoftwareforprivateclouddeployment,pla

THINbarebonewith8thGen.Intel®DesktopCoreiProcessor

Features ƒThindesignwith44.2mminheight ƒThinbarebonewithmulti-IOportsissuitableforvarietyofapplication environmentswithDC-indesign ƒEasy/quickinstallationforadditionalperipherals ƒOne2.5shock-resistantdrivebay ƒSupportWall/VESA/RackmountingKit ƒLocktype

Intel8thGenUSeriesPalm-sizedFanlessSystem

Features ƒEquippowerful8th-GenIntel®Core™iprocessor ƒPalm-sizedchassisdesign(180x116.7x66mm) ƒDiversesystemI/O:4xCOM,4xUSB,2xHDMI,2xGbELAN,16-bitGPIO ƒ3xM.2expansionslots(1x2230E-key,1x2242/3042B-Key,1x2280 M-key)foredgeAIcapability ƒWin1

21.5FHDPanelMountMonitor

Features ƒƒ21.5FullHD1920x1080LCDpanelwithLEDbacklightfor20power savingandenvironmentalprotection ƒƒ0~45°Crangeoperatingtemperature ƒƒ5-wireresistive/P-Captouchscreenor3mmtemperedprotectedglass ƒƒTouchinterface:USB&RS-232 ƒƒFlexiblesignalinterface:VGA

15XGAFrontIP65IndustrialMonitor

Features ƒFrontIP65forwaterproofanddustproof ƒ15XGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒ-20~+60°Cwiderangeoperatingtemperature ƒ5-wireresistiveandP-captouchscreensolutionortemperedsmudge resistantprotectedglass ƒMultiple

CompactIoTEdgeComputerwithIntel®Core™iProcessor,2xGbE,4xUSB3.2,2xRS-232/422/485,1xHDMI,1xDP,1xGPIO

Features ƒ8thgenerationIntel®Core™iprocessor ƒ2xGbE,4xUSB3.2,2xRS-232/422/485,1xHDMI,1xDP,1xGPIO(8bit) ƒCompact,fanlessdesign ƒRubberstopperforstandmountandoptionalkitforDIN-railmounting ƒCanbeexpandedtofacilitatewirelesscommunication ƒThreaded

12.1PanelPCwith8/9thGenerationIntel®Core™i/Celeron®Processor

Features ƒ12.1TFTXGALCDpanelwithresistivetouchcontrol ƒ8th/9thgenerationIntel®Core™i/Celeron®processor(thermalpowerdesign: 35W) ƒ2x260-pinSO-DIMMDDR42666MHz(max.32GB) ƒ1xM.22230(Ekey) ƒ1xmSATAbay(SATASSD+mSATAsupportRAID0&1) ƒ1xOptionalTPM2.0

DevelopmentBoardforSMARCv2.0RISCModule

Features ƒƒSupportsSGeTSMARCv2.0CPUmoduleboard ƒƒ4kindsofdisplayoutputs.18/24-bitLVDSorMIPIDSI,HDMI,DP ƒƒ1xSATA/SATA-DOM,2xRJ-45,1xUSB3.0TypeC,1xUSB2.0OTG, 1xUSB3.0,1xUSB2.0,2xUSB2.0PinHeaders,2xCANbus,4xUART, 12xGPIO ƒƒ3xPCIeby1

EdgeCloudServerwithSignageCMS

Features ƒIntegratedhardwareplussoftwareforback-enddataserviceandlightprivate cloud ƒOpenandStandardstructure:kubernetesBuilt-in,MultipleDBConnections, On-demandMicroservices ƒIntegratedIoTSoftware:PrivateCloudDeployment,PlatformManagement, ApplicationIntegratio

8Industrial-GradeTabletwithQualcomm®Snapdragon™660Processor,Android12withAndroidEnterpriseRecommended

Features ƒQualcomm®Snapdragon™660processorwithAndroid12andAndroid EnterpriseRecommendedcertification ƒ8industrial-gradeLCDwith1920x1200resolution,400-nitbrightness,and upto12,000hoursMTBF ƒProjectedcapacitivetouchscreenwithscratch-resistantCorning®Gorilla® Glas

23.8MultimodalClinicalDisplay

Features ƒWide23.8screenwithFullHD1920x1080resolution ƒFanlessdesignwithoptoinalupgradeIP54-ratedprotectionforsuperior hygieneandinfectioncontrol ƒMultimodaldesignforeasyupgradesandmaintenance ƒWith10pointmulti-touchcontrolfunction

21Point-of-CareTerminalwith11thGenerationIntel®Processor

Features ƒ11thgenerationIntel®Core™i5/i7processor ƒ21.5fullHDdisplaywithmulti-touchP-CAPcontrol ƒMultipleI/O,includingUSB3.2Gen2(TypeA),USB3.2Gen2(TypeC)with displayfunction,andHDMI ƒPCIex4,miniPCIe,M.2expansionslotsforintegratingadd-onmodules ƒFa

21MultimodalTerminalwith8thGenerationIntel®Processor

Features ƒ8thgenerationIntel®Core™i5/celeronprocessor ƒ21.5fullHDdisplaywithmulti-touchP-CAPcontrol ƒM.2expansionslotsforintegratingadd-onmodules ƒFanlessdesignwithupgradeIP54-ratedprotectionforsuperiorhygieneand infectioncontrol ƒEquippedwithAdvantech’sDe

2UHighPerformanceRackmountServerwithAMDEPYC™7003Processor

Features ƒUpto12bays3.5SAS/SATAand2bays2.5NVMEdrives(optional) ƒ16xDDR4ECC-Registered2933/3200MhzRDIMM ƒUpto5PCIeGen4and3PCIeGen3 ƒ2M.22280SATA/PCIesupport ƒ1OCP3.0PCIeGen4x16NICsupport

1UNetworkAppliancewith12thGenIntel®CoreProcessorsforNetworkSecurityandManagement

Features ƒProcessorhybriddesigncombiningPerformance-coreswith Efficient-coressupportingupto16cores/24threadsforoutstandingmulti threadedperformance ƒ1GbE/2.5GbE/10GbEmultiEthernetinterface ƒExpandableviaAdvantechNetworkMezzanineCard(NMC)withupto 100GbEbandwidth

2UHCIServerwith3rdGen.Intel®Xeon®ScalableProcessors

Features ƒBalancedCPU&GPUperformancebyspreadcorelayout ƒWidetemperaturesupportupto40°C ƒUpto5xlowprofilePCI-EGen4slots ƒ12x3.5HDD,2x2.5SATAHDDand2xM.2NVME ƒUpto16xDDR43200RDIMM/LRDIMM ƒAdvantechplatfrommanagementbyRedfishandsecuredwebi

1URackmountNetworkAppliancewithIntel®Atom™ProcessorC2000forvE-CPEandNetworkApplications

Features ƒƒSupportsIntel®Atom™®C2000SystemOnChipupto8coresProcessor ƒƒ2x1GbERJ45implementedbyIntel®i210formanagement ƒƒ4x1GbERJ45byMarvellwith2segmentadvancedLANbypasssupport ƒƒMultiplestorageoptionsdependsonsystemperformancerequirement ƒƒTestedandC

2URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,2NMCslots

Features ƒƒIntel®Xeon®ProcessorE3v3familyand4thGenIntel®Core™i7/i5/i3 Processors,Intel®Pentium®andIntel®Celeron®Processor ƒƒ4xDDR3Un-buffered1333/1600DIMMs,upto32GB ƒƒ8xIntel®i210-AT10/100/1000MbpsLANonboardwithupto3bypass segments ƒƒUpto2Network

DevelopmentBoardforQsevenV2.1ROMModules

Features ƒSupportsQsevenV2.1RISCModule ƒMini-ITXformfactor ƒDualdisplayoutputsHDMI2.0and24-bitLVDS ƒSupports1xPCIe,1xGbE,4xUSB2.0,1xUSBOTG2.0,1xSATAII, 1xI2C,1xI2S,1xCANbus,8xGPIOs ƒSupportAT/ATXmode,Inputpower+12V ƒCablepackincluded ƒ

HighCoreDensity2UNetworkAppliancewithSecurityandAccelerationFeaturesReady

Features ƒSingleAMDEPYC™7003processorupto64Cores/128Threads ƒ16xDDR43200/2933R-DIMMupto1TBsystemcapacity ƒ8xNetworkMezzanineslotswith16GB/sthroughputperslot ƒ2xhot-swappable2.5SATASSD/U.2PCIeNVMeforeasymaintenance ƒRedundantF/Wimagestominimizerisks

UniversalNetworkAppliancewithIntelAtom®P5300/C5300ProcessorforuCPE/SD-WANandNGFW

Features ƒCompactsizeandscalableperformanceformainstreamsmallandmedium branchdeployment ƒPoweredbyIntelAtom®P5300/C5300processortechnology,scalablefrom 4-core,8-core,12-corethenupto20-coreenvironmentformulti-coreNFVi networkapplicaton ƒMultipleEthernetinterf

1URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,4NMCslots

Features ƒƒSupportsIntel®Xeon®ProcessorE3-1275/E3-1225/E3-1268LV3and4th GenIntel®Core™Processorsi5-4570TE,i3-4360,i3-4330,i3-4330TE,Intel® Pentium®ProcessorG3320TEandIntel®Celeron®ProcessorG1820TE. ƒƒSupports2channelfourDDR3ECCUn-buffered1333/1600DIMMs, upto32GB

1UHighPerformanceRackmountServerwith3rdGen.Intel®Xeon®Scalableprocessors

Features ƒIdealforhyperconvergedstorage,software-definedstorage,andhighend enterpriseserver ƒUpto4bays3.5SAS/SATAdrivessupport ƒDualsocketP+LGA41893rdGen.Intel®Xeon®Scalableprocessorssupport ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒHighlyscala

2URackmountNetworkAppliancewithIntel®Xeon®ProcessorScalableFamily,upto8NMCslots

Features ƒƒ2xIntel®Xeon®ScalableProcessorsPlatinum8100,Gold6100&5100, Silver4100andBronze3100 ƒƒ24xDDR42133/2400/2666ECCregisteredmemoryupto1536GB ƒƒC626PCH,40Gb/sQATsupport ƒƒ8xNMC(NetworkMezzanineCard)slotsforawiderangeofGbE,10GbE, 40GbEand100

TabletopNetworkAppliancewithIntel®Atom™ProcessorC2000forvE-CPEandNetworkApplications

Features ƒƒSupportsIntel®Atom™ProcessorC2000SystemOnChipupto4cores ƒƒ2x1GbERJ45implementedbyIntel®i210formanagement ƒƒ4x1GbERJ45byMarvellwith2segmentadvancedLANbypasssupport ƒƒMultiplestorageoptionsdependsonsystemperformancerequirement ƒƒTestedandCe

1URackmountNetworkAppliancewithIntel®Xeon®ProcessorDFamilyforvE-CPEandNetworkApplications,2NMCslots

Features ƒƒIntel®Xeon®ProcessorDSystemOnChipupto16coresand1.5MBlast levelcachepercore ƒƒ4xDDR4ECCUDIMMs/RDIMMsandRDIMMs,upto2400MHzandupto 128GB ƒƒ4serverclassGbEportsimplementedbyanIntel®i350EthernetController withadvancedLANbypasssupport ƒƒ2

2URackmountHybridNetworkServerwithIntel®Xeon®ProcessorScalableFamily,upto3NMCslots

Features ƒƒ2xIntel®Xeon®ScalableProcessorsPlatinum8100,Gold6100&5100, Silver4100andBronze3100 ƒƒ24xDDR42133/2400/2666ECCregisteredmemoryupto1536GB ƒƒC621orC622PCHw/2x10GSFP+support ƒƒ3xNMC(NetworkMezzanineCard)slotsforawiderangeofGbE,10GbE, 40G

2URackmountNetworkAppliancewithdual3rdGenIntel®Xeon®Scalableprocessors,upto8NMCslots

Features ƒ2xIntel®Xeon®ScalableProcessorsPlatinum8300,Gold6300,Gold& 5300orSilver4300 ƒ32xDDR42666/2933/3200ECCregisteredmemoryupto2048GB ƒ8xNMC(NetworkMezzanineCard)slotsforawiderangeofGbE,10GbE, 40GbEand100GbENMCswithorwithoutAdvancedLANbypass

Cascadable Amplifier 10 to 2500 MHz

Cascadable Amplifier 10 to 2500 MHz

Cascadable Amplifier 10 kHz to 2500 MHz

Operational Amplifiers

Operational Amplifiers

Integrated Circuit Operational Amplifier