型号 功能描述 生产厂家 企业 LOGO 操作

Ultra Low Power Bluetooth 5.1 SoC

Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interfac

DialogDialog Semiconductor

戴乐格

SmartBond TINY Bluetooth® LE Module

▪ Bluetooth® • Compatible with Bluetooth® v5.1, • ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core • Supports up to three connections • Renesas registered BD address preprogrammed in OTP ▪ Processing and memories • 16 MHz 32-bit Arm® Co

RENESAS

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Heyco®-Tite Brass Liquid Tight Cordgrips

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SmartBond TINYTM Module

文件:2.15323 Mbytes Page:32 Pages

DialogDialog Semiconductor

戴乐格

Pioneer IoT Add?륮n Shield

文件:227.28 Kbytes Page:2 Pages

SPARKFUN

更新时间:2025-12-20 18:10:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
DIALOG
21+
WFQFN24
150000
全新原装公司现货
DIALOG
22+
WFQFN24
10000
全新、原装
DIALOG/RENESAS
24+
WFQFN24
98671
专业代理蓝牙芯片原装现货
N/A
24+
N/A
32048
原厂可订货,技术支持,直接渠道。可签保供合同
DIALOG
22+
WFQFN24
8113
原装正品现货假一罚十
DIALOG
23+
N/A
10000
正规渠道,只有原装!
DIALOG/戴乐格
24+
WFQFN24
860000
只做原装正品现货
RENESAS
2024+
N/A
70000
柒号只做原装 现货价秒杀全网
DIALOG
25+
QFN
32000
DIALOG全新特价DA14531-00000FX2即刻询购立享优惠#长期有货
DIALOG
21+
SOP
19960
现货库存,有单来谈

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