0.3 or 0.4 mm pitch, 3 mm above the board, Flip-Lock actuator, Flexible Printed Circuit ZIF connectors

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包装：散装 描述：CONN FFC BOTTOM R/A 连接器，互连器件 FFC、FPC（扁平柔性）连接器组件

连接器

包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CONN FPC BOTTOM 80POS 0.30MM R/A 连接器，互连器件 FFC、FPC（扁平柔性）连接器组件

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

SCHOTTKY-DUAL DIODES

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