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DualCool™packagingtechnology,providesbothbottom-andtop-sidecoolinginaPQFNpackage.NotonlyisthePQFNfootprintanindustrystandard,itprovidesthedesignerwithperformanceflexibility.Withenhanceddualpaththermalperformanceandimprovedparasiticsoveritswire-bondedpredece

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DualCool™packagingtechnology,providesbothbottom-andtop-sidecoolinginaPQFNpackage.NotonlyisthePQFNfootprintanindustrystandard,itprovidesthedesignerwithperformanceflexibility.Withenhanceddualpaththermalperformanceandimprovedparasiticsoveritswire-bondedpredece

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